International Business Machines Corporation

Globalfoundries Inc.

Jerry M Chow

Jay Michael Gambetta

Patryk Gumann

Salvatore Bernardo Olivadese

David William Abraham

Matthias Steffen

Martin O Sandberg

Vivekananda P Adiga

Mary Beth Rothwell

James Robert Rozen

Hanhee Paik

Antonio D Corcoles Gonzalez

Sami Rosenblatt

Baleegh Abdo

Easwar Magesan

David C Mckay

John Aaron Smolin

Jason Scott Orcutt

Markus Brink

Nicholas Torleiv Bronn

George Andrew Keefe

Antonio Corcoles-Gonzalez

Maika Takita

Nicholas A Masluk

Jae-Woong Nah

Dongbing Shao

Chad Tyler Rigetti

Douglas Max Gill

Mark Edward Podlaseck

Sean Hart

Christopher B Lirakis

Valerio A Grendanin

Seth T Merkel

Michael S Gordon

Michael A Boraas

Firat Solgun

Abhinav Kandala

Daniela Florentina Bogorin

Sarah Elizabeth Sheldon

Oblesh Jinka

Zlatko Kristev Minev

Christopher W Surovic

David Zarsky

Gilbert Bauer

Raymond A Watters

Amir Niknammoghadam

Pieter Vorselman

Michael Kriegshauser

David Bryant

Robert Meinel

Adiga Vivekananda

Computer assembly housing

Techniques facilitating custom thermal shields for cryogenic environments are provided. In one example, a cryostat can comprise a thermal shield extending between a thermal stage and a base structure coupled to a bottom plate of an outer vacuum chamber. The thermal stage can be coupled to a top plate of the outer vacuum chamber. The thermal shield can provide access to a sample mounting surface encompassed within the thermal shield from a region external to the outer vacuum chamber via the top and bottom plates of the outer vacuum chamber.

Custom thermal shields for cryogenic environments

A method for adjusting a resonance frequency of a qubit in a quantum mechanical device includes providing a substrate having a frontside and a backside, the frontside having at least one qubit formed thereon, the at least one qubit comprising capacitor pads; and removing substrate material from the backside of the substrate at an area opposite the at least one qubit to alter a capacitance around the at least one qubit so as to adjust a resonance frequency of the at least one qubit.

Superconducting qubit capacitance and frequency of operation tuning

A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.

Cryogenic packaging for thermalization of low temperature devices

Lattice arrangements for quantum qubits are described. A lattice arrangement can comprise adjacent structures having vertices connected by edges. The qubits can be positioned on the vertices. A qubit in the lattice arrangement directly connects to not more than three other qubits, or connects to another qubit via a coupling qubit on an edge between two qubits on a vertex. The adjacent structures can comprise hexagons, dodecagons or octagons. A superconducting qubit lattice can comprise superconducting target qubits and superconducting control qubits. The superconducting qubit lattice can comprise adjacent structures having vertices connected by edges, with target qubits positioned on the vertices and control qubits positioned on the edges. Logic operations between adjacent superconducting target and control qubits can be implemented by driving the superconducting control qubit at or near the frequency of the superconducting target qubit.

Reducing qubit frequency collisions through lattice design

Techniques facilitating transfer port systems for cryogenic environments are provided. In one example, an outer vacuum chamber of a cryostat can comprise a sidewall encompassing an inner chamber comprising a sample mounting surface. The sidewall can comprise a feedthrough port providing access to the sample mounting surface from a region external to the outer vacuum chamber.

Transfer port system for cryogenic environments

A quantum circuit includes a quantum signal unit. There is a first quantum chip comprising a plurality of qubit devices and bi-directionally coupled to the quantum signal unit. A first quantum entangling unit is bi-directionally coupled to the quantum signal unit and configured to generate an entanglement between a first and a second qubit device on the first quantum chip via the quantum signal unit.

Scalable interconnected quantum architecture

Techniques facilitating low thermal conductivity support systems within cryogenic environments are provided. In one example, a cryostat can comprise a support rod and a washer. The support rod can couple first and second thermal stages of the cryostat. The washer can intervene between the support rod and the first thermal stage. The washer can thermally isolate the support rod and the first thermal stage.

Low thermal conductivity support system for cryogenic environments

Techniques facilitating multiple cryogenic systems sectioned within a common vacuum space are provided. In one example, a cryostat can comprise a plurality of thermal stages and a thermal switch. The plurality of thermal stages can intervene between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that can be directly coupled mechanically to the Still stage via a support rod. The thermal switch can be coupled to the intermediate thermal stage and an adjacent thermal stage. The thermal switch can facilitate modifying a thermal profile of the cryostat by providing a switchable thermal path between the intermediate thermal stage and the adjacent thermal stage.

Multiple cryogenic systems sectioned within a common vacuum space

Techniques for facilitating reduced thermal resistance attenuator on high-thermal conductivity substrates for quantum applications are provided. A device can comprise a substrate that provides a thermal conductivity level that is more than a defined thermal conductivity level. The device can also comprise one or more grooved transmission lines formed in the substrate. The one or more grooved transmission lines can comprise a powder substance. Further, the device can comprise one or more copper heat sinks formed in the substrate. The one or more copper heat sinks can provide a ground connection. Further, the one or more copper heat sinks can be formed adjacent to the one or more grooved transmission lines.

Reduced thermal resistance attenuator on high-thermal conductivity substrates for quantum applications

Techniques facilitating efficient thermal profile management within cryogenic environments are provided. In one example, a cryostat can comprise a plurality of thermal stages intervening between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that provides additional cooling capacity for the cryostat. The intermediate thermal stage can be directly coupled mechanically to the Still stage via a support rod.

1 kelvin and 300 millikelvin thermal stages for cryogenic environments

Techniques facilitating mechanical vibration management for cryogenic environments are provided. In one example, a system can comprise a processor that executes computer executable components stored in memory. The computer executable components can comprise a linearization component and a drive component. The linearization component can translate data indicative of a nonlinear drive signal into a linear drive signal. The drive component can dynamically control operation of a compressor of a cryocooler using the linear drive signal. The cryocooler can provide cooling capacity for a cryogenic environment.

Asynchronous drive of cryocooling systems for low temperature applications

A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (T) with a structure of a dilution fridge stage (stage).

Well thermalized microstrip formation for flexible cryogenic microwave lines in quantum applications

A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.

Well thermalized stripline formation for high-density connections in quantum applications

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White Plains, NY, United States of America

Jerry M Chow