Texas Instruments Corporation

Jerry L Elkind

Jose L Melendez

Richard A Carr

John G Quinn

Surface plasmon resonance (SPR) sensor biointerface with a rigid thiol linker layer and/or interaction layer ligand loading with reversible collapse and/or iron oxide nanoparticle sensor response amplification.

Biosensor and method

A miniaturized sensor (,) that improves the confidence measure of a given sample reading by directing the flow of sample to the sensor/sample interface (,) and thus bringing the sample reliably in contact with the sensor's biosensing film. An inlet flow channel (,) extending from the bottom (,) of the sensor (,) to the sensing surface (,). The inlet channel (,) guides the sample to a cavity 115 formed at a housing surface (,) where it interacts with the film deposit (,). An outlet channel (,) extends from the cavity (,) to the bottom surface (,) and directs the sample outside the device. The light source (,), detector array (,) and interface (,) can be added to the structure providing a fully integrated miniaturized sensor. Various well known methods of manufacturing may be used including mill casting, split molding and double mold processes.

Optically based miniaturized sensor with integrated fluidics

A procedure for planarizing a group II-VI composition which includes a resist and etch-back procedure wherein a thick resist coating relative to the degree of non-planarity is spun over a non-planar group II-VI layer to provide a planar resist surface. The resist is then etched back to the group II-VI layer with etching of both the resist and the group II-VI layer then continuing simultaneously and at substantially the same etch rate until all of the resist has been removed. The etching takes place in a chamber having a parallel plate RF plasma etcher using a dry etchant which uses the RF plasma. The etchant is a hydrogen and oxygen combination at low pressure which is activated by the RF excitation. An inert gas, preferably argon, and methane can optionally be added to the gas flow. The flow rate at each inlet is continuously adjustable. The flow of gas into the chamber continues while the chamber is also being pumped simultaneously to maintain the desired pressure within the chamber. This produces hydrogen radicals and oxygen radicals and this mixture etches both the group II-VI insulator and the photoresist. By controlling the etch conditions, the group II-VI insulator and the photoresist are etched at the same rate.

Growing community of inventors

Dallas, TX, United States of America

Jerry L Elkind