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Lockheed Martin Corporation

Lockhead Martin Corp.

Jerry L Draper

Bernie F Carpenter

Duane D Grosskrueger

Brian W Easom

Russell N Gehling

A shape memory alloy hinge assembly for deploying at least a first object in a controllable, substantially shockless manner is disclosed. Generally, the hinge assembly includes at least a first flexure member capable of moving from a first, folded configuration to a second, straightened configuration, and a controller for controlling the movement of at least the first flexure member as the first flexure member moves or reconfigures from the folded configuration to the straightened configuration.

Shape memory alloy controllable hinge apparatus

A process for conditioning shape memory alloys is disclosed. The process preferably includes force application/release cycling of a shape memory alloy at a temperature above the martensitic-austenitic transformation (A.sub.f) finish temperature of the alloy, but below the maximum temperature at which an austenitic-martensitic transformation will be effected by the force application. The alloy is preferably cold-worked and annealed prior to force application/release cycling. The invention yields greater control over martensitic-austenitic and austenitic-martensitic transformation temperatures and yields reduced hysteresis variability. In certain disclosed embodiments a TiNi or CuAl containing alloy may be cold-worked between about 20% and 45%, and annealed to maintain between about 3% and 8% of the cold working. The alloy may then be heated to between about A.sub.f and 5.degree. C. and A.sub.f 15.degree. C. and conditioned via the application/release of a force for at least about 50 cycles, wherein an austenitic-martensitic phase transformation is induced. The conditioned alloy may then be cooled and integrated into an application mechanism for subsequent selective activation upon heating.

Process for conditioning shape memory alloys

A system for detuning from resonance a support structure which receives vibratory energy is disclosed. In one embodiment, the system includes a substrate actuator having at least a first wire embedded in a substrate matrix material, the actuator being couplable to the support structure. The system may further include a heater for heating at least the first wire from a first to a second temperature to increase the modulus of elasticity of the first wire, which in turn increases the stiffness of the substrate actuator. Such an increase in the stiffness of the substrate actuator detunes from resonance structures supporting a device from which vibratory energy emanates, and also inhibits transmission of vibratory energy of specific frequencies into structures supporting equipment sensitive to vibrations.

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Littleton, CO, United States of America

Jerry L Draper