United Microelectronics Corp.

Other

Jerry Jaw

Min-Chih John Hsuan

Charlie Han

Tung-Chi Liu

A preburn-in DRAM module circuit board is provided, which allows a plurality of DRAM modules to be constructed directly thereon, and which can be directly connected to a large burn-in oven so as to perform a burn-in process concurrently on the DRAM modules mounted thereon to check for any defected IC chips that are to be reworked. After the burn-in process, each of the DRAM modules can be cut apart from the circuit board to serve as a single memory module. The preburn-in DRAM module circuit board allows the manufacturing process for the DRAM modules to be reduced in schedule and manufacturing cost. Material cost can also be saved since the burn-in circuit and the module circuit are arranged on the same circuit board.

Preburn-in dynamic random access memory module and preburn-in circuit board thereof

An A/D converter that settles the converted digital result requiring no timing signal for synchronously-triggered conversion operation is disclosed. The A/D converter converts analog signals into digital signals in a limited number of rippling feedback operations in short time delay periods utilizing a simple circuit configuration that includes a network of parallel comparators. Each of the comparators is fed with a corresponding voltage reference supply by a resistor network. Each of the resistor networks includes series connections of resistors and a corresponding switch means that reflects the status of a determined data bit of the converted data. The circuitry configuration is relatively simply in structure and settles to a converted digital data in short periods of time that requires no synchronizing clock signal.

High-speed analog-to-digital converter

A repairable memory module, such as a DRAM (dynamic random access memory) or a flash memory module, and a method of repairing memory modules are proposed. Based on the repairable memory module, any failed memory ICs in the module that are found before shipment or after use can be repaired through the use of a backup memory IC. Fundamentally, when any failed memory ICs are found in the module, a set of zero-ohm resistors are used to short-circuit a number of selected pairs of jumping pads to thereby redirect the connections to the I/O (input/output) and column-address strobe pins on the failed memory IC instead to the same nominal pins on the backup memory IC. This allows the function of the failed ICs to be instead performed by the backup memory chip.

Growing community of inventors

Hsinchu Hsien, Taiwan

Jerry Jaw