Delta Design, Inc.

Unisys Corporation

Jerry Ihor Tustaniwskyi

James Wittman Babcock

Ronald Allen Norell

Leonard Harry Alton

Ronald Jack Kuntz

Henry Kuo

James Wittman Babock

A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an open end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplets on a portion of an IC-module which holds the IC-chip. This spraying of the liquid coolant occurs while the seal ring is pressed against the IC-module. Also, a pressure reducing means is coupled to the container for producing a sub-atmospheric pressure in the space between the container and the IC-module while the seal ring is pressed against the IC-module.

Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressure

A mechanical assembly, for regulating the temperature of an electronic device, includes a gimbal and a heat-exchanger which is attached to the gimbal. The gimbal includes a base member, a carrier member, and a spring which has&#x2014;1) a first end with a rigid coupling to one of the base and carrier members, and 2) a second end with a slideable coupling to the remaining member. The slideable coupling prevents any gap from occurring between the heat-exchanger and the electronic device when they are pressed together.

Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end

Method of maintaining an IC-module near a set-point

A temperature control system includes an electro-mechanical subassembly having an enhanced thermal interface, which comprises: an electronic device which has a face that dissipates heat; a heat exchange member which has a face that mates with the heat dissipating face of the electronic device; and, a film of liquid, lying between the mating faces of the heat exchange member and the electronic device, which evaporates without leaving any residue at a temperature that is too low to damage the electronic device. Due to the presence of the liquid film, the thermal resistance between the mating faces of the heat exchange member and the electronic device is reduced by over 1000% from which it otherwise is when film is deleted.

Electro-mechnical subassembly having a greatly reduced thermal

A pressure-mountable, electro-mechanical assembly includes a housing which holds an integrated circuit chip in an open cavity; and, the housing has conductors that connect the chip to a pattern of metal pads on an exterior surface of the housing. A lid lies on the exterior surface of the housing, covers the cavity, and has terminal holes that match and expose the pattern of metal pads. Respective conductive springs are held in the terminal holes, contact the metal pads, and project from the lid. This lid operates as both a protective cover for the chip and a carrier for the springs.

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Mission Viejo, CA, United States of America

Jerry Ihor Tustaniwskyi