Texas Instruments Corporation

Jerry Gomez Cayabyab

Mark Gerald M Cruz

Dolores Babaran Milo

Laura May Antoinette Dela Paz Clemente

Edward R De La Rosa

Norbert Joson Santos

Edgar Dorotayo Balidoy

Alvin Lopez Andaya

Connie Alagadan Esteron

Jeniffer Otero Aspuria

Mark Gerald Rosario Pinlac

Ruby Ann Maya Merto

Anthony Steven Dominisac Panagan

Julian Carlo Concepc Barbadillo

Mark Gerald Muyco Cruz

Ma Celine Ramirez Mandapat

Edsel Gomez Balagtas

Bobby Johns Lansangan Villacarlos

Juan Carlo Aro Rimando

Ferdinand S Signey

A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.

Semiconductor device package with a cap to selectively exclude contact with mold compound

Apparatus to store singulated wafers for transport, including multiple wafer assemblies stacked in the interior of a container housing, the individual wafer assemblies including an expanded laser diced wafer singulated into dies, a first frame spaced outward from the wafer on a carrier structure, a second frame spaced outward from the wafer and inward from the first frame on the carrier structure, and a foam structure that supports the second frame and the carrier structure.

Transport packaging and method for expanded wafers

A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structure. The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome-shaped chuck, breaking the perforations in the wafer.

Dicing a wafer

A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit ('IC') component stacks mounted on the leadframe strip.

Window clamp

A semiconductor device having a leadframe including a pad () surrounded by elongated leads () spaced from the pad by a gap () and extending to a frame, the pad and the leads having a first thickness () and a first and an opposite and parallel second surface; the leads having a first portion () of first thickness near the gap and a second portion () of first thickness near the frame, and a zone () of reduced second thickness () between the first and second portions; the second surface () of the first lead portions is coplanar with the second surface () of the second portions. A semiconductor chip () with a terminal is attached the pad. A metallic wire connection () from the terminal to an adjacent lead includes a stitch bond () attached to the first surface of the lead.

Structure and method for stabilizing leads in wire-bonded semiconductor devices

A lead frame strip includes an array of sites arranged in at least one row connected to two exterior side rails which traverse the lead frame strip on two opposite sides. Each of the sites is further connected to the two exterior side rails by subrails which extend between the two exterior side rails. Interior side rails extend between the subrails having a length dimension oriented along a first direction. The interior side rails include at least one punch degating aperture having an aperture length oriented along the first direction, wherein a total of the aperture length along the interior side rails is greater than or equal to the die pad length.

Lead frame strip for reduced mold sticking during degating

According to one embodiment of the invention, a method for auto-boating includes supporting a tape substrate having first and second end portions on a boat, sandwiching the first and second end portions between respective ones of a pair of end sleeves and the boat, coupling a boat clip to the boat, and removing the end sleeves from between the first and second end portions and the boat clip.

System and method for improved auto-boating

According to one embodiment of the invention, a system used in auto-boating includes a tape substrate supported by a boat. The tape substrate includes a pair of lateral edges parallel to one another and each having respective first and second ends, and a pair of longitudinal guide strips parallel to one another. One of the longitudinal guide strips extends between the respective first ends of the pair of lateral edges and the other longitudinal guide strip extends between the respective second ends of the pair of lateral edges. The tape substrate also includes a plurality of die attach regions disposed within the area defined by the pair of lateral edges and the pair of longitudinal guide strips. The system further includes a boat clip coupled to the boat such that the tape substrate is sandwiched between the boat and the boat clip. Each longitudinal guide strip includes a pair of tabs disposed at opposite ends thereof such that each tab extends beyond a respective one of the lateral edges.

A device () and a method () for controlling resin bleed, the device comprising a substrate () having a surface (), an integrated circuit () having a plurality of leads () extending therefrom, and an adhesive () comprising a plurality of components. The adhesive () generally resides between the surface () of the substrate () and the integrated circuit (), wherein the integrated circuit is generally bonded to the substrate. The device () further comprises a plurality of electrically-conductive bonding pads () associated with the surface () of the substrate and a plurality of studs () respectively formed over the plurality of bonding pads. A plurality of leads () are electrically connected to a top surface () of the each respective stud (), wherein a height () of each stud is defined between the respective bonding pad () and the top surface of the stud, and wherein the height of the each stud generally prevents one or more of the plurality of components from bleeding onto the top surface thereof.

Growing community of inventors

Baguio, Philippines

Jerry Gomez Cayabyab