Excelitas Canada, Inc.

Jerry Deleon

Arthur John Barlow

Xianzhu Zhang

Jin Han Ju

Robert Burman

Juergen Schliz

Embodiments of a laminate leadless carrier package are presented. The package includes an optoelectronic chip, a substrate supporting the optoelectronic chip, a plurality of conductive slotted vias, a wire bond pad disposed on the top surface of the substrate, a wire bond coupled to the optoelectronic chip and the wire bond pad and an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate. The slotted vias provide electrical connections between the top conductive layer and the bottom conductive layer. The substrate includes a plurality of conductive and dielectric layers laminated together including a bottom conductive layer, a top conductive layer, and a dielectric layer between the top and bottom conductive layers. The encapsulation is a molding compound, and the molding compound is pulled back from at least one of the slotted vias.

Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same

A laminate leadless carrier package having a semiconductor chip mounted at the edge of a recess region in a substrate supporting the chip, the substrate having a plurality of conductive and dielectric layers, a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate. An encapsulation covers the laser chip, the wire bond, and at least a portion of the top surface of the substrate including the recess region. The encapsulation is an optically transparent molding compound. The package is arranged to be mounted as a side-looker and/or a top-looker.

Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

A laminate leadless carrier package comprising an optoelectronic chip, a substrate supporting the chip, the substrate comprising a plurality of conductive and dielectric layers; a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate; an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate, wherein the encapsulation is a molding compound; and wherein the package is arranged to be mounted as a side-looker. A process for manufacturing laminate leadless carrier packages, comprising preparing a substrate; applying epoxy adhesive to a die attach pad; mounting an optoelectronic chip on the die attach pad; wire-bonding the optoelectronic chip; molding a molding compound to form an encapsulation covering the optoelectronic chip, a wire bond, and the top surface of the substrate; and dicing the substrate into individual packages.

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Calamba, Philippines

Jerry Deleon