Intel Corporation

Jerry D Bolen

Xiaoning Ye

Dennis J Miller

John M Lynch

Methods and apparatus that minimize the impedance discontinuity between a component and a signal trace is described. The methods and apparatus generally comprise at least one signal trace disposed on a dielectric layer, wherein the signal trace comprises a first width which is wider than a second width, a via connected to the first width of the signal trace, and a component electrically attached to the via, wherein an impedance discontinuity between the signal trace and the component is lowered.

Methods for minimizing the impedance discontinuity between a conductive trace and a component and structures formed thereby

According to some embodiments, a device includes a connector to hold an electrical module at an acute angle with respect to a surface on which the connector is to be mounted, and a first contact, a first portion of the first contact to contact the surface and a second portion of the contact to contact the electrical module, a distance between the first portion and the second portion equal to a first length. A device may also include a second contact adjacent to the first contact, a first portion of the second contact to contact the surface and a second portion of the second contact to contact the electrical module, a distance between the first portion of the second contact and the second portion of the second contact substantially equal to the first length.

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Molalla, OR, United States of America

Jerry D Bolen