Advanced Micro Devices Corporation

Ati Technologies Ulc

Jerry Anton Ahrens, Jr

Amitabh Mehra

Anil Harwani

Joshua Taylor Knight

William R Alverson

Grant E Ley

Jayesh Joshi

Alicia Wen Ju Yurie Leong

William Robert Alverson

Grant Evan Ley

John William Abshier

Charles Sum Yuen Lee

System memory training with chipset attached memory is described. In accordance with the described techniques, a request is received to train a system memory of a device. Responsive to the request, contents of the system memory are transferred to a chipset attached memory. The device is operated using the contents from the chipset attached memory. While the device is being operated using the contents from the chipset attached memory, the system memory is dynamically trained. After the training is complete, the contents are transferred back from the chipset attached memory to the trained system memory.

System memory training with chipset attached memory

Duplicating memory content with chipset attached memory is described. In accordance with the described techniques, contents of a system memory are duplicated on a chipset attached memory over a chipset link. Memory requests are serviced using the contents of the system memory and the contents on the chipset attached memory. Servicing the memory requests includes servicing a first portion of a read request using the contents of the system memory and a second, remaining portion of the read request using the contents on the chipset attached memory. Servicing the memory requests further includes communicating a write request to the system memory and to the chipset attached memory.

Duplicating memory content with chipset attached memory

Package lids with carveouts configured to expose lights directly connected to an internal component of a processor are described. Lid carveouts are configured to precisely align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device via a press fit connection, while maintaining visibility of lights directly connected to processor internal components when the cooling device is connected. Lid carveouts are further configured to expose one or more connectors disposed on a processor surface that supports its internal component. When contacted by corresponding connectors of an auxiliary device, such as a light not integrated into a processor package or a cooling device, the lid carveouts enable direct connections between the package's internal components and the auxiliary device.

Lid carveouts for processor lighting

Extended training for memory is described. In accordance with the described techniques, a training request to train a memory with extended training is received. The extended training corresponds to a longer amount of time than a default training. The extended training of the memory is performed using a set of target memory settings. In one or more implementations, the extended training is performed during a boot up phase of the computing device.

Extended training for memory

Automated memory overclocking is described. In accordance with the described techniques, one or more sets of overclocked memory settings of a memory are automatically selected for performance testing and stability testing of the memory. The one or more sets of the overclocked memory settings are tested for performance of the memory and a performance indication is output for each of the one or more sets of the overclocked memory settings. The one or more sets of the overclocked memory settings are tested for stability of the memory and a stability indication is output for each of the one or more sets of the overclocked memory settings. One of the one or more sets of the overclocked memory settings are selected as optimized overclocked memory settings for the memory.

Automated memory overclocking

Physical adjustment to system memory with chipset attached memory is described. In accordance with the described techniques, an indication for making one or more physical adjustments to system memory of a device is received. Contents of the system memory are transferred via a chipset link to a chipset attached memory. The device is operated using the contents from the chipset attached memory while the one or more physical adjustments are made to adjust the system memory. After the one or more physical adjustments, the contents are transferred back from the chipset attached memory to the adjusted system memory via the chipset link.

Physical adjustment to system memory with chipset attached memory

Random access memory (RAM) is attached to an input/output (I/O) controller of a chipset (e.g., on a motherboard). This chipset attached RAM is optionally used as part of a tiered storage solution with other tiers including, for example, nonvolatile memory (e.g., a solid state drive (SSD)) or a hard disk drive. The chipset attached RAM is separate from the system memory, allowing the chipset attached RAM to be used to speed up access to frequently used data stored in the tiered storage solution without reducing the amount of system memory available to an operating system running on the one or more processing units.

Chipset attached random access memory

A method and apparatus for managing processor functionality includes receiving, by the processor, data relating to one or more environmental conditions. The processor compares the data to pre-existing parameters to determine whether or not the environmental conditions are within the pre-existing parameters for normal operation. If the data are within the pre-existing parameters for normal operation, the processor is operated in a normal operation mode. If the data are outside the pre-existing parameters for normal operation, the processor operates in a second operation mode which is dynamically determined and calibrated during power-on, boot and operation.

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Sister Bay, WI, United States of America

Jerry Anton Ahrens, Jr