Advanced Micro Devices Corporation

Ati Technologies Ulc

Jerry A Ahrens

Amitabh Mehra

Anil Harwani

William R Alverson

Grant E Ley

Joshua Taylor Knight

Jayesh Joshi

Scott E Swanstrom

Mustansir M Pratapgarhwala

Richard Martin Born

Dirk J Robinson

Kenneth Mitchell

Charles Sy Lee

Package lids with carveouts configured for processor connection and alignment are described. Lid carveouts are configured to align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device. Because the lid carveouts ensure precise alignment and orientation of a cooling device relative to a package lid, the lid design enables targeted cooling of discrete portions of the lid. Lid carveouts are further configured to expose one or more connectors disposed on a surface that supports package internal components. When contacted by corresponding connectors of a cooling device, the lid carveouts enable direct connections between the package and the attached cooling device. By creating a direct connection between package components and an attached cooling device, the lid carveouts enable a high-speed connection for proactive and on-demand cooling actuation.

Lid carveouts for processor connection and alignment

Core activation and deactivation for a multi-core processor is described. In accordance with the described techniques, a processor having multiple cores operates using a first core configuration. A request to switch from the first core configuration to a second core configuration is received. Responsive to the request, a switch from the first core configuration to the second core configuration occurs by adjusting a number of active cores of the processor without rebooting.

Core activation and deactivation for a multi-core processor

User configurable hardware settings for overclocking is described. In accordance with the described techniques, user input to adjust hardware settings for operating a processing unit in an overclocking mode is received. The user input, for example, adjusts at least one of a voltage droop threshold or a frequency adjustment of the clock rate. A voltage droop is detected while operating the processing unit in the overclocking mode. Responsive to detecting the voltage droop, a clock rate of the processing unit is adjusted based at least in part on the adjusted hardware settings.

User configurable hardware settings for overclocking

Automatic central processing unit (CPU) usage optimization includes: monitoring performance activity of a workload comprising a plurality of threads; and modifying a resource allocation of a plurality of cores for the plurality of threads based on the performance activity.

Automatic central processing unit (CPU) usage optimization

Profile switching for memory overclocking is described. In accordance with the described techniques, a memory is operated according to a first memory profile. During operation of the memory according to the first memory profile, a request is received to operate the memory according to a second memory profile. Responsive to the request, operation of the memory is switched to operate according to the second memory profile without rebooting. In one or more implementations, at least one of the first memory profile or the second memory profile comprises an overclocking memory profile that configures the memory to operate in an overclocking mode. In one or more implementations, the memory is trained to operate according to the overclocking memory profile prior to operating the memory according to the first memory profile.

Real time profile switching for memory overclocking

Methods and apparatuses control the clock rate of a processing unit. The methods and apparatus control the clock rate by generating an output clock rate based on the determined frequency adjustment such that the processing unit maintains the overclocking. The methods include: receiving an analog voltage supply in response to detecting overclocking in the processing unit; dynamically sensing measurements of an output voltage from a voltage generator based on the received analog voltage supply; determining characteristics of a voltage droop in the output voltage based on the dynamically sensed output voltage measurements; determining a frequency adjustment for the clock rate of the processing unit based on the determined characteristics of the voltage droop; and generating an output clock rate based on the determined frequency adjustment such that the processing unit maintains the overclocking.

System and method for enabling clock stretching during overclocking in response to voltage droop

Automatic memory overclocking, including: increasing a memory frequency setting for a memory module until a memory stability test fails; determining an overclocked memory frequency setting including a highest memory frequency setting passing the memory stability test; and generating a profile including the overclocked memory frequency setting.

Automatic memory overclocking

Automatic part testing includes: booting a part under testing into a first operating environment; executing, via the first operating environment, one or more test patterns on the part; performing a comparison between one or more observed characteristics associated with the one or more test patterns and one or more expected characteristics; and modifying one or more operational parameters of a central processing unit of the part based on the comparison.

Automatic part testing

Automatic voltage reconfiguration in a computer processor including one or more cores includes executing one or more user-specified workloads; determining, based on the user-specified workloads, a respective minimum safe voltage for each core of one or more cores; and modifying a respective voltage configuration for each core of the one or more cores based on the respective minimum safe voltage.

Growing community of inventors

Austin, TX, United States of America

Jerry A Ahrens