International Business Machines Corporation

Globalfoundries Inc.

Suss Microtec Inc.

Jerome D Cohen

Christopher Lee Tessler

Michael Teich

Robert G Haas

Enrico Herz

David Clifford Long

Jon Alfred Casey

Mark J LaPlante

Thomas Anthony Wassick

Krystyna Waleria Semkow

Brian Richard Sundlof

Robert Anthony Rita

Richard Francis Indyk

Donald Rene Wall

Glenn A Pomerantz

James G Balz

Arthur Gilman Merryman

Michael Berger

Charles J Hendricks

Richard Philip Surprenant

Kathleen M Wiley

Lori A Maiorino

Patrick E Spencer

Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.

Removing material from defective opening in glass mold

Removing material from defective opening in glass mold and related glass mold for injection molded solder

A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

Electronic package repair process

Growing community of inventors

Poughquag, NY, United States of America

Jerome D Cohen