Lumileds Lighting U.s., LLC

Maxim Integrated Products, Inc.

Philips Lumileds Lighting Company LLC

Insyte Systems, Inc.

Lumileds LLC

Koninklijke Philips Corporation N.v.

Lytro, Inc.

Google Inc.

Qualcomm Technologies, Inc.

Jerome Chandra Bhat

Daniel Alexander Steigerwald

Michael Joseph Ludowise

Salman Akram

Arvin Emadi

Richard Ian Olsen

Jim Chih-Min Cheng

Colvin Pitts

Yi-Ren Ng

Ravi Kiran Nalla

Steven David Oliver

Graham Butler Myhre

William David Collins, Iii

William D Houck, Ii

Eric Paul Lee

Tony Yip Pang Poon

Brandon Elliott Merle Clarke

Kumar Nagarajan

Serge Laurent Rudaz

Kuolung Lei

Craig A Easson

Quanbo Zou

Judy Hermann

Paul Scott Martin

Arkadii V Samoilov

Mark Melvin Butterworth

Nathan Fredrick Gardner

Michael David Camras

Oleg Borisovich Shchekin

Grigoriy Basin

Kenneth John Vampola

Nicole Dorene Kerness

Kurt Akeley

Christopher Francis Edwards

Anand K Chamakura

Cheng-Wei Pei

Dan G Allen

Han Ho Choi

Seshasayee S Ankireddi

Richard I Olsen

Steven A Maranowski

Stanley Barnett

Seshasayee Gaddamraja

Reena Khare

Cresente S Elpedes

Ken Wang

Steven T Boles

Tian Tian

Robert Blank

Minh Ngoc Trieu

Kumar Nagaranjan

An electrochemical cell for sensing gas has added mechanical support for the working electrode to prevent flexure of the working electrode due to pressure differentials. The added mechanical support includes: 1) affixing a larger area of the working electrode to the body of the cell; 2) a gas vent to a cavity of the body to equalize pressures; 3) a rigid electrolyte layer abutting a back surface of the working electrode; 4) infusing an adhesive deep into sides of the porous working electrode to enhance rigidity; 5) supporting opposing surfaces of the working electrode with the rigid package body; and 6) other techniques to make the working electrode more rigid. A bias circuit is also described that uses a controllable current source, an integrator of the varying current, and a feedback circuit for supplying a voltage to the counter electrode and a bias voltage to the reference electrode.

Electrochemical gas sensor with varying bias voltage and environmental compensation

A method according to embodiments of the invention includes providing a wafer of semiconductor devices grown on a growth substrate. The wafer of semiconductor devices has a first surface and a second surface opposite the first surface. The second surface is a surface of the growth substrate. The method further includes bonding the first surface to a first wafer and bonding the second surface to a second wafer. In some embodiments, the first and second wafer each have a different coefficient of thermal expansion than the growth substrate. In some embodiments, the second wafer may compensate for stress introduced to the wafer of semiconductor devices by the first wafer.

Method of bonding a semiconductor device to a support substrate

A bio-sensor device, integrated with a display portion, includes a surface for touching by a body part, such as a finger. A light source, such as an array of LEDs, emit light through the surface so as to be reflected and partially absorbed by the body part An array of photodetectors detects light reflected back by the body part and generates signals corresponding to an image of the light reflection, which corresponds to the light absorption pattern in the body part. The light absorption pattern may correlate to a fingerprint, a blood vessel pattern, blood movement within the blood vessels, combinations thereof, or other biometric feature. A processor receives the signals from the photodetectors and analyzes the signals to determine a characteristic of the body part. The characteristic may be used to authenticate the user of the bio-sensor device by comparing the detected characteristic to a stored characteristic.

Integrated light emitting display, IR light source, and sensors for detecting biologic characteristics

An electrochemical sensor device that is efficiently and economically produced at the chip level for a variety of applications is disclosed. In some aspects, the device is made on or using a wafer technology whereby a sensor chamber is created by said wafer and a gas port allows for a working electrode of the sensor to detect certain gases. Large scale production is possible using wafer technology where individual sensors are produced from one or more common wafers. Integrated circuits are made in or on the wafers in an integrated way so that the wafers provide the substrate for the integrated circuitry and interconnects as well as providing the definition of the chambers in which the gas sensors are disposed.

Chip-scale sensing device for low density material

A bio-sensor device includes a surface for touching by a body part, such as a finger. A light source, such as an array of LEDs, emit light through the surface so as to be reflected and partially absorbed by the body part An array of photodetectors detects light reflected back by the body part and generates signals corresponding to an image of the light reflection, which corresponds to the light absorption pattern in the body part. The light absorption pattern may correlate to a fingerprint, a blood vessel pattern, blood movement within the blood vessels, or other biometric feature. A processor receives the signals from the photodetectors and analyzes the signals to determine a characteristic of the body part. The characteristic may be used to authenticate the user of the bio-sensor device by comparing the detected characteristic to a stored characteristic.

Light emitter and sensors for detecting biologic characteristics

An electrochemical gas sensor device with small physical footprint is disclosed. The electrodes within the element are arranged about the electrolyte such that the electrical impedance of the sensor is minimized. This results in a fast stabilization after detecting gasses and enables rapid changes in bias voltage to target different gasses. Gasketing elements, or alternative designs, are included to eliminate the diffusion of gasses between the electrodes within the cell.

Low impedance sensor for low density materials

In one embodiment, a semiconductor device wafer () contains electrical components and has electrodes () on a first side of the device wafer (). A transparent carrier wafer () is bonded to the first side of the device wafer () using a bonding material () (e.g., a polymer or metal). The second side of the device wafer () is then processed, such as thinned, while the carrier wafer () provides mechanical support for the device wafer (). The carrier wafer () is then de-bonded from the device wafer () by passing a laser beam () through the carrier wafer (), the carrier wafer () being substantially transparent to the wavelength of the beam. The beam impinges on the bonding material (), which absorbs the beam's energy, to break the chemical bonds between the bonding material () and the carrier wafer (). The released carrier wafer () is then removed from the device wafer (), and the residual bonding material is cleaned from the device wafer ().

Laser de-bond carrier wafer from device wafer

Electrochemical gas sensor system with improved accuracy and speed

Integrated light emitting display and sensors for detecting biologic characteristics

The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.

Non-contact temperature measurement sensor

A mobile thermal sensor system, a mobile device case, and a process for fabricating a mobile thermal sensor system are described that include using a heat spreader (e.g., a heat sink). In an implementation, the mobile thermal sensor system includes a substrate configured to support an electrical component; a thermal detector package coupled to the substrate, the thermal detector package including a first thermopile, a second thermopile, and a reference temperature detector; and a heat spreader coupled to the substrate. In another implementation, a mobile device case can include a case configured to house a mobile device, where the mobile device includes a mobile thermal sensor system.

Thermal management of thermal sensor in a mobile device

Embodiments of the invention include a semiconductor structure () including a light emitting layer. A substrate () comprising lithium is attached to the semiconductor structure (). A surface of the substrate () forms an angle with a major plane of the semiconductor structure () that is between 60&#xb0; and 75&#xb0;.

Light emitting device including shaped substrate

A structure according to embodiments of the invention includes a semiconductor light emitting device and an optical element disposed over the semiconductor light emitting device. The semiconductor light emitting device is disposed in a recess in the optical element. A reflector is disposed on a bottom surface of the optical element. A method according to embodiments of the invention includes disposing a semiconductor light emitting device on a substrate and forming a reflector adjacent the semiconductor light emitting device. An optical element is formed over the semiconductor light emitting device. The semiconductor light emitting device is removed from the substrate.

Light emitting device with an optical element and a reflector

An image capture device, such as a camera, has multiple modes including a light field image capture mode, a conventional 2D image capture mode, and at least one intermediate image capture mode. By changing position and/or properties of the microlens array (MLA) in front of the image sensor, changes in 2D spatial resolution and angular resolution can be attained. In at least one embodiment, such changes can be performed in a continuous manner, allowing a continuum of intermediate modes to be attained.

Image capture device having light field image capture mode, 2D image capture mode, and intermediate capture mode

Growing community of inventors

Palo Alto, CA, United States of America

Jerome Chandra Bhat