Sandia Corporation

National Technology & Engineering Solutions of Sandia, LLC

Jerome A Rejent

Ronald P Manginell

Matthew Wallace Moorman

Paul T Vianco

An aspect of the present disclosure relates to a microsampler for hermetically sealing a sample. In particular, such microsamplers can be useful for encapsulation of chemical, biological, and explosive samples for the purposes of archival sample storage. Methods of making and using such microsamplers are also described herein.

Microsampler and method of making the same

A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0&lt;x&lt;5 percent by weight based on the weight of tin effective to depress the melting point of the tin-silver composition to a desired level. Melting point ranges from about 218.degree. C. down to about 205.degree. C. depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10.degree. C./min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight).

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Albuquerque, NM, United States of America

Jerome A Rejent