Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno

Dsm IP Assets B.v.

Jeroen Anthonius Smeltink

Herman Hendrikus Maalderink

Jacobus Hubertus Theodoor Jamar

Ruud Olieslagers

Gerrit Oosterhuis

Ike Gerke De Vries

Egbert Anne Martijn Brouwer

Johannes Adrianus Cornelis Theeuwes

Maarten Van Lent

Jeroen Arjan Van Herp

A fluid handling structure for a gas phase deposition apparatus, the structure defining a flow path with an inlet and an outlet for transmitting pressurized fluid from said inlet to the outlet, wherein the structure includes an elongated slit and a series of nozzles through which pressurized fluid is allowed to enter the elongated slit, the inlet being upstream the series of nozzles, and wherein the outlet is formed downstream at a gap opening of the elongated slit allowing pressurized fluid to discharge from the elongated slit towards a substrate, wherein the series of nozzles are configured to provide a larger flow resistance than the elongated slit, and wherein the series of nozzles are adapted to form a series of jet flows directed towards one or more impingement surfaces of the structure when pressurized fluid is transmitted through the flow path.

Fluid handling structure and method for a gas phase deposition apparatus

A slot-die coating apparatus for manufacturing a patterned coating layer () on a substrate () comprises a substrate carrier (), a coating device, a sensor facility () and a controller (). The substrate carrier () is arranged on a support for providing the substrate (). The coating device comprises a head-side unit and a support-side unit (resp.) that are mutually movable with respect to each other by a motor (). The head-side unit comprises a translator part () and a slot-die coating head (). The support-side unit () comprises a stator part () of the motor. The controller () controls the motor () to position the slot-die coating head at a desired distance (Ds). The support-side unit () has a mass that is at least equal to the mass of the head-side unit (), and the support-side unit () is flexibly coupled to the support ().

Slot-die coating method and apparatus

An additive fabrication apparatus with an efficient reversal mechanism to reverse the orientation of foil guiding rollers is contemplated. To this end, according to an aspect, a foil guiding system comprising: a flexible foil guiding roller; and a bearing system arranged to bear said guiding roller, said bearing system comprised of end locking elements axially locking to the roller; a bearing arrangement defining a bearing position having the roller curved in bearing engagement. The bearing arrangement engages with an outer face of said roller in a manner so as to thereby flex the roller between at least two bearing positions in conformity with a rolling direction. The flexible roller in connection with the outside bearings replaces a fixed shaft arrangement of the prior art, which is easily tunable to the foil movement direction.

Foil guiding system for additive fabrication

A method for providing position control information for controlling an impingement position of a laser beam for treatment of a chip die in a chip manufacturing process, comprises the steps of a) receiving a specification of positions (x,y) of a electrically conductive elements in the chip die, the positions having a first coordinate along a first direction (x) and a second coordinate (y) along a second direction in a plane defined by the chip die, said first and second direction being mutually transverse to each other, b) selecting a cluster of positions that is within a predetermined two-dimensional spatial range, wherein each pair of positions in the cluster at least has a first minimum difference in their first coordinates or a second minimum difference in their second coordinates and removing the next position from the ordered set, c) update the positions of the set of positions in accordance with an expected time needed to carry out the treatment for said cluster and a speed of a wafer comprising the chip die, d) repeating steps b-d until each of the positions in said set is assigned to a cluster.

Providing a chip die with electrically conductive elements

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Mierlo, Netherlands

Jeroen Anthonius Smeltink