Google Inc.

J R Thermal LLC

Asetek A/s

Jeremy Rice

Jeffrey Scott Spaulding

Huan D Nguyen

Bill Dailey

Gregory P Imwalle

Monem H Alyaser

Soheil Farshchian

Evan Fraisse

An enhanced gravity-driven, thin film condensation heat transfer condenser is disclosed for use in a thermosyphon performing in two perpendicular orientations, as well as orientations in between. The thermosyphon includes an evaporator fluidly coupled to a first condenser configured with a plurality of fins, with each of the plurality of fins having notches adjacent to flanges, the notches forming vapor flow channels through the plurality of fins. The first condenser is fluidly coupled to a second condenser, and vapor flowing from the evaporator must first pass through the first condenser before entering the second condenser.

Two-orientation condenser for enhanced gravity driven film condensation

Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.

Impinging jet manifold for chip cooling near edge jets

The device and methods described herein relate to the isothermal heat transport through an intermittent liquid supply to an evaporator device, thereby enabling high evaporative heat transfer coefficients. A liquid and vapor mixture flows through miniature and micro-channels in an evaporator and addresses flow instabilities encountered in these channels as bubbles rapidly expand. Additionally, a high percentage of the fins are exposed to vapor and limit the required charge of refrigerant t within the system due to effective condensate removal in the condenser.

Intermittent thermosyphon

A thermosyphon having a condenser located below the evaporator, or an evaporator above the condenser, is presented. Various embodiments include serially configured evaporators and condensers, so that the excess pressure head from any condenser to evaporator liquid coupling may be utilized to overcome deficient pressure head in a subsequent condenser to evaporator liquid coupling.

Serial thermosyphon

A thermosyphon having an evaporator, a condenser having a condenser liquid pool accumulated at the bottom thereof creating a condenser liquid pool surface, a vapor tube fluidly coupling the evaporator to the condenser, and a liquid tube fluidly coupling the condenser to the evaporator, wherein the liquid tube apex is above the condenser liquid pool surface, thereby trapping vapor and preventing liquid from passing from the condenser to the evaporator. The application of heat to the evaporator increases the total system internal temperature and pressure causing condensation of the vapor in the liquid tube. As the liquid level in the liquid tube increases above the lower interior surface of the apex of the liquid tube, the liquid tube is primed thereby creating the pressure head needed to overcome the hydrodynamic losses inside the thermosyphon. Various embodiments allow passive start-up, regardless of the initial distribution of liquid inside the thermosyphon.

Self-priming thermosyphon

A thermosiphon system includes a condenser, an evaporator, and a condensate line fluidically coupling the condenser to the evaporator. The condensate line can be a tube with parallel passages can be used to carry the liquid condensate from the condenser to the evaporator and to carry the vapor from the evaporator to the condenser. The evaporator can be integrated into the tube. The condenser can be constructed with an angled core. The entire assembly can be constructed using a single material, e.g., aluminum, and can be brazed together in a single brazing operation.

Thermosiphon systems for electronic devices

The device and methods described herein relate to the isothermal heat transport through an intermittent liquid supply to an evaporator device, thereby enabling high evaporative heat transfer coefficients. A liquid and vapor mixture flows through miniature and micro-channels in an evaporator and addresses flow instabilities encountered in these channels as bubbles rapidly expand. Additionally, a high percentage of the fins are exposed to vapor and limit the required charge of refrigerant within the system due to effective condensate removal in the condenser.

A thermosiphon system includes a condenser and an evaporator fluidly coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick.

A method of assembling a thermosiphon system includes placing a base of an evaporator and a tube of a condensate line in a brazing fixture such that the base covers an aperture in a bottom of the tube with a bottom surface of the base abutting a precision machined surface of the brazing fixture, and simultaneously brazing the base and the tube while held by the brazing fixture to form a unitary body in a single brazing process, the unitary body including the evaporator and the condensate line.

Manufacturing process for thermosiphon heat exchanger

Fluid to fluid heat exchange processes involve the hot fluid reducing in temperature and the cold fluid increasing in temperature. To transfer heat between the two fluids, a third, separated heat transfer fluid is often used. The present invention allows for passive heat transfer between the two fluids, using a separate heat transfer fluid, while enabling heat absorption and rejection through a continuously variable temperature.

Temperature glide thermosyphon and heat pipe

Techniques for cooling a data center include circulating a first cooling medium to cool a plurality of rack-mounted computers; circulating a second cooling medium to cool the plurality of rack-mounted computers; determining that a first portion of the plurality of rack-mounted computers is operating at a power usage above a threshold power usage; adjusting at least one of a flow rate of the first or second cooling mediums to cool a second portion of the plurality of rack-mounted computers; and rerouting a portion at least one the first or second cooling mediums to cool the first portion of the plurality of rack-mounted computers.

Growing community of inventors

Austin, TX, United States of America

Jeremy Rice