Google Inc.

Ampere Computing LLC

Jeremy Plunkett

Wael Zohni

William P Schmidt

Michael John Sebastian Smith

Joseph Charles Fjelstad

Suresh Rajan

David T Wang

Philip Arnold Ferolito

Daniel L Rosenband

Alfred Yeung

Michael J S Smith

Jeremy Werner

Rich Thaik

April Lambert

A semiconductor chip allows for a selected amount of on-die decoupling capacitance to be connected to a very-large-scale integrated circuit (VLSI) system after the circuit design is complete. The semiconductor chip comprises an integrated circuit disposed on a packaging substrate, and a power distribution network that is electrically connectable to the integrated circuit via a programmable connectivity array via the packaging substrate.

Package programmable decoupling capacitor array

One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

Embossed heat spreader

A system, method, and apparatus are included for providing additional space between an integrated circuit package and a circuit board. An integrated circuit package is provided including a plurality of integrated circuit package contacts. Also provided is a circuit board in electrical communication with the integrated circuit package. Further, the integrated circuit package, the integrated circuit contacts, and/or the circuit board is configured for providing additional space between the integrated circuit package and the circuit board to position at least a portion of at least one component between the integrated circuit package and the circuit board.

Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween

Growing community of inventors

San Jose, CA, United States of America

Jeremy Plunkett