D-wave Systems Inc.

1372934 B.c. Ltd

Jeremy P Hilton

Geordie Rose

Alexandre M Zagoskin

Mohammad H S Amin

Byong Hyop Oh

Eric G Ladizinsky

Alexandre Blais

Paul I Bunyk

Zdravko G Ivanov

Eugene Dantsker

Alexander Tzalenchuk

Richard G Harris

Mark W Johnson

Alexander Tzalentchuk

Alexander Maassen Van Den Brink

Kelly T R Boothby

Colin P Williams

Alexander Omelyanchouk

Timothy Duty

Anatoly Yu Smirnov

Marcel Franz

Yutian Ling

Andrew Joseph Berkley

Trevor Michael Lanting

Mohammad H Amin

Andrew Douglas King

Miles F H Steininger

Sergey V Uchaykin

George E G Sterling

Richard David Neufeld

Loren J Swenson

Aidan Patrick Roy

Emile M Hoskinson

Randall Black

Colin C Enderud

James King

William W Bernoudy

Peter D Spear

Gregory Dean Peregrym

Alexandr M Tcaciuc

J Craig Petroff

Edmond Ho Yin Kan

Alexander Ya Tzalenchuk

Amar B Kamdar

Chunqing Deng

Brock Wilson

Pedro A De Buen

Gregory Citver

Eric Ladizinsky

Travis Oh

Various techniques and apparatus permit fabrication of superconductive circuits. A niobium/aluminum oxide/niobium trilayer may be formed and individual Josephson Junctions (JJs) formed. A protective cap may protect a JJ during fabrication. A hybrid dielectric may be formed. A superconductive integrated circuit may be formed using a subtractive patterning and/or additive patterning. A superconducting metal layer may be deposited by electroplating and/or polished by chemical-mechanical planarization. The thickness of an inner layer dielectric may be controlled by a deposition process. A substrate may include a base of silicon and top layer including aluminum oxide. Depositing of superconducting metal layer may be stopped or paused to allow cooling before completion. Multiple layers may be aligned by patterning an alignment marker in a superconducting metal layer.

Systems and methods for fabrication of superconducting integrated circuits

A hybrid computing system for solving a computational problem includes a digital processor, a quantum processor having qubits and coupling devices that together define a working graph of the quantum processor, and at least one nontransitory processor-readable medium communicatively coupleable to the digital processor which stores at least one of processor-executable instructions or data. The digital processor receives a computational problem, and programs the quantum processor with a first set of bias fields and a first set of coupling strengths. The quantum processor generates samples as potential solutions to an approximation of the problem. The digital processor updates the approximation by determining a second set of bias fields based at least in part on the first set of bias fields and a first set of mean fields that are based at least in part on the first set of samples and coupling strengths of one or more virtual coupling devices.

Systems and methods for hybrid analog and digital processing of a computational problem using mean fields

Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.

An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.

Method of fabricating an electrical filter for use with superconducting-based computing systems

Topologies for analog computing systems are provided. Qubits in the topology are grouped into cells, and cells are coupled to adjacent cells by inter-cell couplers. At least some cells are coupled to non-adjacent cells via long-range couplers. Long-range couplers may be arranged into coverings so that certain sets of qubits within a covering region may be coupled with a reduced number of couplers. Each cell within a covering region without a long-range coupler may be proximate to a cell with a long range coupler so that each cell within the covering region is no more than a certain coupling distance away from a long-range coupler. Long-range couplers may couple over a greater physical distance than inter-cell couplers. Long-range couplers may couple to qubits over a larger coupling region, and may extend across multiple crossing regions between qubits.

Systems and methods for increasing analog processor connectivity

In a quantum processor some couplers couple a given qubit to a nearest neighbor qubit (e.g., vertically and horizontally in an ordered 2D array), other couplers couple to next-nearest neighbor qubits (e.g., diagonally in the ordered 2D array). Couplers may include half-couplers, to selectively provide communicative coupling between a given qubit and other qubits, which may or may not be nearest or even next-nearest-neighbors. Tunable couplers selective mediate communicative coupling. A control system may impose a connectivity on a quantum processor, different than an 'as designed' or 'as manufactured' physical connectivity. Imposition may be via a digital processor processing a working or updated working graph, to map or embed a problem graph. A set of exclude qubits may be created from a comparison of hardware and working graphs. An annealing schedule may adjust a respective normalized inductance of one or more qubits, for instance to exclude certain qubits.

Quantum processor with instance programmable qubit connectivity

Systems and methods for integrating quantum computing systems into mobile systems for the purpose of providing real-time, quantum computer-based control of the mobile systems are described. A mobile system includes a data extraction subsystem that extracts data from an external environment of the mobile system and a quantum computing subsystem that receives data from the data extraction subsystem and performs a quantum computing operation in real-time using the data from the data extraction subsystem. A result of the quantum computing operation influences a behavior of the mobile system, such as the navigation of the mobile system or an action performed by the mobile system. The on-board quantum computing subsystem includes on-board quantum computing infrastructure that is adapted to suit the needs and spatial constraints of the mobile system.

Systems and methods for real-time quantum computer-based control of mobile systems

Cryogenic refrigeration employs a pulse tube cryo-cooler and a dilution refrigerator to provide very low temperature cooling, for example, to cool superconducting processors. Continuous cryogenic cycle refrigeration may be achieved using multiple adsorption pumps. Various improvements may include multiple distinct thermal-linking points, evaporation pots with cooling structures, and/or one or more gas-gap heat switches which may be integral to an adsorption pump. A reservoir volume may provide pressure relief when the system is warmed above cryogenic temperature, reducing the mass of the system. Additional heat exchangers and/or separate paths for condensation and evaporation may be provided. Multi-channel connectors may be used, and/or connectors formed of a regenerative material with a high specific heat capacity at cryogenic temperature. Flexible PCBs may provide thermal links to components that embody temperature gradients. Various components may be pre-cooled, for example via a switchable thermalization system.

Systems, methods, and apparatus for cryogenic refrigeration

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Jeremy P Hilton