Applied Materials, Inc.

Kla Tencor Corporation

Kla Corporation

Jeremy Nesbitt

Christopher Dennis Bencher

Mehdi Vaez-Iravani

Guoheng Zhao

Richard Wallingford

Grace Hsiu-Ling Chen

Jing Zhang

David Craig Oram

Jagadeesh Kumar

Joshua Knight

Timothy Russin

Vadim Palshin

Suneet Luniya

Kevin Lai

Mike Murugan

Mark Bailey

A system which may be used to increase the number of available spectrum bands in an inspection system is provided. The system may include an illumination source configured to emit broadband illumination. The system may also include a filter assembly including two or more filter units. The two or more filter units may include two or more filters with one or more varying filtering characteristics. The system may also include two or more motors configured to selectively actuate selected filters of the filter units into the beam of illumination. Using the system, the number of available spectrum bands to be used in an inspection system may be increased.

Filter assembly for providing adjustable spectral capabilities in a broadband inspection system

An inspection system may include an optical component configured to deliver inspection light to a subject and a detector configured to obtain an image of the subject based on the inspection light delivered to the subject. The inspection system may also include a processor in communication with the optical component and the detector. The processor may be configured to: measure an aberration of the optical component based on the image of the subject obtained by the detector; and adjust the optical component to compensate for a change in the aberration.

Imaging performance optimization methods for semiconductor wafer inspection

The present disclosure generally relates to lithography devices comprising an image projection system. The image projection system comprises a fiber bundle coupled to a first homogenizer and a second homogenizer. The first homogenizer is offset from the second homogenizer along a scan direction. The first homogenizer is optically aligned with a first digital micromirror device, and the second homogenizer is optically aligned with a second digital micromirror device. The first digital micromirror device is offset from the second digital micromirror device along the scan direction within an optical field of view of a projection lens. A scan field of the first digital micromirror device overlaps or aligns with a scan field of the second digital micromirror device to eliminate a gap between the scan field of the first digital micromirror device and the scan field of the second digital micromirror device.

Digital lithography with extended field size

The present disclosure generally relates to lithography devices comprising an autofocus system. The autofocus system is configured to individually focus and adjust a plurality of digital micromirror devices. The autofocus system comprises a single light beam and a diffractive optical element configured to split the single light beam into two or more split beams. The two or more split beams are directed to a beam splitter. The two or more split beams are then reflected off the surface of a substrate to at least one position sensor. The position sensor is configured to measure the position of each of the two or more split beams. At least one digital micromirror device is then individually adjusted based on the measured position to adjust the focus of the at least one digital micromirror device with respect to surface height and tilt variations of the substrate.

Digital lithography with extended depth of focus

An inspection system includes an illumination sub-system, a collection sub-system, and a controller. The illumination sub-system includes an illumination source configured to generate a beam of illumination and a set of illumination optics to direct the beam of illumination to a sample. The collection sub-system includes a set of collection optics to collect illumination emanating from the sample and a detector configured to receive the collected illumination from the sample. The controller is configured to acquire a test image of the sample, reconstruct the test image to enhance the resolution of the test image, and detect one or more defects on the sample based on the reconstructed test image.

Systems and methods for defect detection using image reconstruction

Inspection with multiple illumination regions includes generating a primary beam of illumination directed along a primary illumination direction, transmitting a portion of the primary beam of illumination along a first illumination direction, deflecting a portion of the primary beam of illumination along a second illumination direction different from the first illumination direction with one or more angular selection elements, focusing the transmitted portion of the primary beam of illumination onto a first inspection region of the substrate, and focusing the deflected portion of the primary beam of illumination onto a second inspection region of the substrate being spatially separated from the first inspection region.

Method, apparatus and system for generating multiple spatially separated inspection regions on a substrate

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San Jose, CA, United States of America

Jeremy Nesbitt