3M Innovative Properties Company

Brady Worldwide Corp.

Jeremy M Higgins

Wendy L Thompson

Jay R Lomeda

Audrey S Forticaux

Mario Alberto Perez

Wayne Scott Mahoney

John Charles Clark

Eric G Larson

Timothy D Fletcher

Scott B Charles

Mitchell T Huang

Brett A Beiermann

Clint J Novotny

Kyle R Schwartz

Clinton P Waller, Jr

Satinder K Nayar

Bharat R Acharya

Derek J Dehn

Brandon Alan Bartling

Michael D Savagian

Benjamin J Anderson

Amit J Patel

Alec J Davis

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Polymer matrix composite comprising a porous polymeric network; and a plurality of thermally conductive particles distributed within the polymeric network structure; wherein the thermally conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the thermally conductive particles and the polymer (excluding the solvent); and wherein the polymer matrix composite has a density of at least 0.3 g/cm; and methods for making the same. The polymer matrix composites are useful, for example, in electronic devices.

Polymer matrix composites comprising thermally conductive particles and methods of making the same

The present disclosure provides a resin blend containing a blend of a first phthalonitrile resin, a filler, and a bisphenol M diphthalonitrile ether resin. Suitable fillers include at least one of nanoparticles, microparticles, or fibers. The present disclosure also provides an article including a polymerization product of such a resin blend. The resin blends can be prepared at lower temperatures than phthalonitrile resin blends without a bisphenol M diphthalonitrile ether resin.

Bisphenol M diphthalonitrile ether resin blends including a filler, and articles

An oriented film includes an orientated semi-aromatic polyester layer and a thermally conductive filler dispersed in the orientated semi-aromatic polyester layer. The thermally conductive filler is at least 20% wt. of the oriented film.

Oriented thermally conductive dielectric film

A pressure wash resistant label comprising:

Pressure-wash resistant label

Growing community of inventors

Roseville, MN, United States of America

Jeremy M Higgins