Intel Corporation

Jeremy A Theil

Chien Chiang

David B Fraser

Gary William Ray

Chuanbin Pan

Sychyi Fang

Vicky M Ochoa

Joyce C Sum

An interconnect system is provided. The interconnect system includes a silicon substrate and a first dielectric layer formed upon the silicon substrate. The interconnect system also includes a first level of at least two electrically conductive lines formed upon the first dielectric layer. The interconnect system further includes a region of low dielectric constant material formed between the at least two electrically conductive lines. The interconnect system also includes a first hard mask formed upon the polymer region.

Method for fabricating an interconnect structure with hard mask and low

Interconnect structure with hard mask and low dielectric constant

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Menlo Park, CA, United States of America

Jeremy A Theil