Texas Instruments Corporation

Jeremias Perez Libres

Vikas I Gupta

Navinchandra Kalidas

Joel Tomas Medina

Michael P Pierce

Joseph Edward Grigalunas

Mary C Miller

George A Bednarz

Mario A Bolanos

Abbas I Attarwala

Subramanian Krishnamurthy

Mario A Bolanos-Avila

Jimmy Liang

Chee Moon Ow

Jin Sin Sai

Indran B Nair

Julius Lim

Shih-Fang Chuang

Chee Tay Liang

Thongioem Phanatnok

Apparatus for assembling a semiconductor device has a plate with body and a surface heatable to a controlled a temperature profile from location to location across the plate. Mesas at same temperature of plate protrude from the surface are configured to support a portion of the substrate. Movable capillaries have openings for blowing cooled gas onto selected locations of the assembly. At least one movable syringe movable has an opening for dispensing a polymer precursor.

Apparatus for thermal control of semiconductor chip assembly and underfill

A method and apparatus for assembling a semiconductor device. A chip () with solder bodies () on its contact pads is flipped onto a substrate (). After the reflow process, a gap () spaces chip and substrate apart. A polymer precursor is selected for its viscosity of known temperature dependence. The apparatus has a plate () with heating and cooling means to select and control a temperature profile from location to location across the plate. After preheating, the assembly is placed on a mesa () of the plate configured to heat only a portion of the substrate. Movable capillaries () blow cooled gas onto selected locations of the assembly. After the temperature profile is reached, a quantity of the precursor is deposited at a chip side and pulled into the gap by capillary action. The capillary flow is controlled by controlling the precursor viscosity based on the temperature profile, resulting in a substantially linear front, until the gap is filled substantially without voids.

Thermal method to control underfill flow in semiconductor devices

A semiconductor assembly () comprising a semiconductor device (), which has a plurality of metallic contact pads () and an outline by sides (). A metallic bump () made of reflowable metal is attached to each of these contact pads. An electrically insulating substrate () has a surface with a plurality of metallic terminal pads () in locations matching the locations of the device contact pads, and further a plurality of grooves () and humps () distributed between the terminal pad locations, complementing the distribution of the terminal pads. Each bump is further attached to its matching terminal pad, respectively; the device is thus interconnected with the substrate and spaced apart by a gap (). Adherent polymeric material () containing inorganic fillers fills the gap substantially without voids.

Grooved substrates for uniform underfilling solder ball assembled electronic devices

Disclosed is a semiconductor device that includes an electrically insulating, sheet-like substrate with first and second surfaces, at least one opening, and a certain thickness. On the first surface are a plurality of electrically conductive routing strips and a plurality of contact pads; at least one of the contact pads is electrically connected with at least one of the routing strips, and may have a solder body attached. A semiconductor chip is positioned in the opening while leaving a gap to the substrate; the chip has an active surface including at least one bond pad, and a passive surface substantially coplanar with the second substrate surface. Substrate thickness and chip thickness may be substantially equal. Bonding elements bridge the gap to connect electrically bond pad and routing strip. Encapsulation material protects the active chip surface and the bonding elements, and fills the gap so that the filler surface is substantially coplanar with the passive chip surface and the second substrate surface. The support tape used in assembly is discarded.

Low profile, chip-scale package and method of fabrication

Disclosed is a semiconductor device that includes an electrically insulating, sheet-like substrate () with first and second surfaces (), at least one opening (), and a certain thickness (). On the first surface are a plurality of electrically conductive routing strips and a plurality of contact pads (); at least one of the contact pads is electrically connected with at least one of the routing strips, and may have a solder body () attached. A semiconductor chip () is positioned in the opening while leaving a gap () to the substrate; the chip has an active surface () including at least one bond pad (), and a passive surface () substantially coplanar with the second substrate surface (). Substrate thickness and chip thickness may be substantially equal. Bonding elements () bridge the gap to connect electrically bond pad and routing strip. Encapsulation material () protects the active chip surface and the bonding elements, and fills the gap so that the filler surface () is substantially coplanar with the passive chip surface and the second substrate surface. The support tape () used in assembly is discarded.

A packaged integrated circuit that includes a substrate; a chipmounted on the substrate; and a heatsinkmounted on the chip. The heatsink has a spacerattached to one of its surfaces to provide a standoff distance between the heatsink and the substrate. The substrate and the heatsink can include moats into which the spacer is adapted to fit. The moat can be a notch at the edge of the substrate or it can be a channel or depression in the substrate surface. The spacer can be made of a high-modulus or low-modulus material, or a combination of the two.

Heatsink-substrate-spacer structure for an integrated-circuit package

Methods for fabricating plastic molded thermally enhanced flip chip packages in which the heat spreaders are assembled in strip format is disclosed, including the first step of providing the heat spreader strip. Inclusion of heat spreaders in strip format allows better automation of the molding process using equipment and fabrication technology known in the industry, and provides a cost effective solution to assembly of high density area array packages. The design of heat spreaders include reduced cross section connecting straps which are readily severed and leave only a small plastic to metal interface for ingress of contamination. Further the designs comprehend either embedded or exposed heat spreaders with methods to hold securely during the molding process.

Method of fabricating flip chip IC packages with heat spreaders in strip format

An improved mold system (,) is provided. The mold system (,) includes a mold (,) having a mold cavity (,). A pot (,) is connected to the mold cavity (,) through a boomerang runner system (,). The boomerang runner system may include a boomerang passage (,) having an inner curvilinear surface (,) and an outer curvilinear surface (,).

Molding method with the use of modified runners

An improved mold system (20) is provided. The mold system (20) includes a mold (30) having at least one mold cavity (28). A pot (22) is connected to each of the mold cavities (28) through a runner system (24). A bellows container (50) containing a molding material (60) is disposed with the pot (22). A plunger (31) applies a compressive load to the molding material (60) contained with the bellows container (50) to force the molding material (60) through the runner system (24) into the mold cavities (28).

Bellows container packaging system and method

A semiconductor package which comprises a lead frame, a semiconductor chip secured to the lead frame and a mold composition encasing the lead frame and the semiconductor chip has a filler of ceramic particles. Each of the ceramic particles, preferably silica or alumina, has macroscopic pores of sufficient size to receive a resin binder therein, the pores extending from the surface of the particle to the particle interior. A permanently hardenable composition adherable to the ceramic particles preferably an epoxy cresol novolac, extends around the ceramic particles and into the pores. The ceramic particles are formed by providing ceramic particles having a macroscopically smooth surface and subjecting the surfaces of the particles to a composition capable of removing portions of the particles, preferably hydrofluoric acid, while agitating the particles to form the pores.

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Garland, TX, United States of America

Jeremias Perez Libres