Qualcomm Incorporated

Jeongkeun Kim

Chang-Ho Lee

Xiaoju Yu

Daniel F Garcia

Francesco Carrara

Mark A Kuhlman

John Jong-Hoon Lee

Supatta Niramarnkarn

Kinfegebriel Amera Mengistie

Ashish Alawani

A package that includes a substrate having a first surface; a solder resist layer coupled to the first surface of the substrate; a device located over the solder resist layer such that a portion of the device touches the solder resist layer; and an encapsulation layer located over the solder resist layer such that the encapsulation layer encapsulates the device. The solder resist layer is configured as a seating plane for the device. The device is located over the solder resist layer such that a surface of the device facing the substrate is approximately parallel to the first surface of the substrate. The solder resist layer includes at least one notch. The device is located over the solder resist layer such that at least one corner of the device touches the at least one notch.

Package comprising a solder resist layer configured as a seating plane for a device

Growing community of inventors

San Diego, CA, United States of America

Jeongkeun Kim