Fairchild Semiconductor Corporation

Lg Electronics Inc.

Chung Ang University Industry Academic Cooperation

Jeongil Lee

Bigildis Dosdos

Myoungho Lee

Charles Suico

David Chong Sook Lim

Adriano M Vilas-Boas

Jongmin Kim

Sangki Woo

Ni Sun

Sangsoo Ahn

Sam Zheng

Hyungki Hong

Seunghoon Oh

Minsub Hwang

Edwin Man Fai Lee

Lee Man Fai Edwin

A micro-bubble generating system according to an embodiment of the present invention may include an electrolytic bath configured to generate primary micro-bubbles; a water supply hose which is connected to an outlet end of the electrolytic bath; and a micro-bubble generating device which is connected to the outlet end of the water supply hose to generate secondary micro-bubbles having a smaller diameter than the primary micro-bubbles.

Microbubble generating system

Generally, this disclosure provides systems, methods and platforms for power multiplexer switching operations. The system may include a near field communication (NFC) module configured to receive power through a radio frequency (RF) channel; a subscriber identity module (SIM) circuit configured with a supply voltage port; and a power multiplexer circuit configured to controllably couple the SIM circuit supply voltage port to the NFC module, wherein the NFC module provides a supply voltage to the SIM circuit such that the SIM circuit is operable in the absence of primary device power source.

Dual input single output power multiplexer for near field communication application

A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.

Multi-chip module for battery power control

Growing community of inventors

Seoul, South Korea

Jeongil Lee