Qualcomm Incorporated

Jeongil Jay Kim

Mohammad Ali Tassoudji

Taesik Yang

Kevin Hsi-Huai Wang

Jorge Fabrega Sanchez

Darryl Sheldon Jessie

Chin-Kwan Kim

Rajneesh Kumar

Jaehyun Yeon

Kevin Hsi Huai Wang

Suhyung Hwang

Alberto Cicalini

Jeahyeong Han

Chaoqi Zhang

Hong-Ming Lee

Assaf Aviv

Sangkil Kim

Mahmoud Niroo Jazi

An antenna system includes: a patch antenna element disposed at a first level of the antenna system; an energy coupler configured and coupled to the patch antenna element to transfer energy between the patch antenna element and a front-end circuit; a ground conductor disposed at a second level of the antenna system, the patch antenna element and the ground conductor being disposed a separation distance away from each other and bounding respective sides of a volume defined by a projection, normal to a surface of the patch antenna element, of the patch antenna element to the ground conductor; and a floating conductor that is displaced from the ground conductor and the patch antenna element, the floating conductor comprising a body extending over a portion of the separation distance outside of, and in close proximity to, the volume.

Antenna system with floating conductor

Methods, systems, and devices for wireless communication are described. According to one or more aspects, the described apparatus includes one or more stacks of patch radiators (such as patch antennas) comprising at least a first patch radiator and a second patch radiator. The first patch radiator is associated with a low-band frequency; the second patch radiator is associated with a high-band frequency. The first patch radiator and the second patch radiator may overlap a ground plane, which may be asymmetric. Some or all patch radiators in a stack may be rotated relative to the ground plane, such that some or all edge of a patch radiator may be nonparallel with one or more edges of the ground plane. Further, each patch radiator stack may include separate feeds for each of at least two frequencies and two polarizations, and thus at least four feeds (one for each frequency/polarization combination) in total.

Patch antenna array

An antenna is described. The antenna includes a first plurality of first elements. Each of the first elements is dual polarized and configured to support a first set of bands and a second set of bands that is mutually exclusive from the first set of bands. The antenna also includes a second plurality of second elements. Each of the second elements is dual polarized and configured to support the second set of bands. The second plurality of second elements is interleaved with the first plurality of first elements.

Multiband antennas

An antenna system includes: a first antenna element configured to transduce between second wireless energy and second transmission-line-conducted energy, wherein the first and second wireless energy are of first and second polarizations of the first antenna element and in first and second directions that are different and define a first plane; and a second antenna element configured to transduce between third wireless energy and third transmission-line-conducted energy and between fourth wireless energy and fourth transmission-line-conducted energy, wherein the third and fourth wireless energy are of first and second polarizations of the second antenna element and in third and fourth directions that are different and define a second plane that is substantially orthogonal to the first plane.

Multi-directional dual-polarized antenna system

Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding. A RFIC package includes an IC die layer that includes a RFIC die(s) mounted on a substrate that includes substrate metallization layers, a substrate core, and substrate antenna layers. The RFIC package includes an EMI shield surrounding the IC die layer and extending down shared sidewalls of the IC die layer and the substrate. The EMI shield extends down the sidewalls of the IC die layer and substrate metallization layers of the substrate to at least the interface between the substrate metallization layers and the substrate core, and without extending adjacent to the sidewall of the substrate antenna layers. In this manner, antenna performance of the antenna module may not be degraded, because extending the EMI shield down sidewalls of the substrate antenna layers can create a resonance cavity in the substrate.

Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding, and related fabrication methods

Various wireless device and antenna array configurations are provided. An example wireless device includes at least one radio frequency integrated circuit, at least one patch antenna element operably coupled to the at least one radio frequency integrated circuit, at least one dipole antenna comprising two dipole antenna elements disposed adjacent to the at least one patch antenna element and operably coupled to the at least one radio frequency integrated circuit, and at least one high impedance surface disposed below the at least one dipole antenna and adjacent to the at least one patch antenna element.

Compact patch and dipole interleaved array antenna

A multi-core broadband printed circuit board (PCB) antenna and methods for fabricating such an antenna are provided. One example antenna implemented with a multi-core PCB generally includes a first core structure, a second core structure disposed above the first core structure, and one or more metal layers disposed above the second core structure or below the first core structure. The first core structure includes a first core layer, a first metal layer disposed below the first core layer, and a second metal layer disposed above the first core layer. The second core structure includes a second core layer, a third metal layer disposed below the second core layer, and a fourth metal layer disposed above the second core layer. The first core layer and the second core layer may have different thicknesses.

Multi-core broadband PCB antenna

Techniques are provided for improving the performance of a multi-band antenna in a wireless device. An example wireless device includes at least one radio frequency integrated circuit, and at least one patch antenna operably coupled to the at least one radio frequency integrated circuit, including a first patch operably coupled to the at least one radio frequency integrated circuit, a ground plane disposed below the first patch, and a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane.

Discrete antenna module with via wall structure

An electronic device includes a first antenna, a second antenna, and a device cover. The first antenna may be configured to transmit or receive signals at a first frequency, and the second antenna may be configured to transmit or receive signals at a second frequency. The device cover may be configured to enclose at least a portion of the device, the and may have a first thickness in a first area and a second thickness in a second area. The first area may be substantially aligned with a boresight of the first antenna, and the second area may be substantially aligned with a boresight of the second antenna. The first thickness may be different than the second thickness.

Growing community of inventors

San Diego, CA, United States of America

Jeongil Jay Kim