Samsung Electronics Co., Ltd.

Lg Electronics Inc.

Jeonghyun Lee

Byoungmok Kim

Yang-yeol Gu

Sungho Choi

Kyungmin Cho

Jaemin Lee

Donghyun Lee

Seonju Lee

Minseok Choi

Dongyeong Kim

Yountae Shin

Chomin Lee

Ae-ryun Kim

Oungu Lee

Jongbo Shim

Jongkyeong Park

Minah Song

Jaemoo Lee

Minchul Kim

Jaejin Lee

Taecheol Park

Jihwang Kim

Seokjun Son

Dongwook Kim

Dongho Kim

Hosang Park

Chansoo Kim

Jiyong Park

Jangmo Shin

Hwanpil Park

Yang-Yeol Gu

Jonghyun Son

Hwan Pil Park

Chan-Yong Yeo

Janghoon Kim

Chanbin Park

Seongik Jeon

Seoyong Park

Eunsu Lee

Yongbum Seo

Wooyeol Yoo

Hansaem Hwang

Kiman Kim

A refrigerator including a cabinet having an outer case; a side panel including a main body; and an upper panel, wherein the side panel is configured to be detachably mounted on an outside of the outer case so that the main body forms an exterior of one side surface of the cabinet while the side panel is mounted to the outside of the outer case, and the upper panel is configured to be detachably coupled to the side panel while the side panel is mounted to the outside of the outer case so that the upper panel covers an upper portion of the cabinet.

Refrigerator

A refrigerator including: a main body forming a storage compartment and a door provided to open and close the storage compartment, wherein the door includes a door frame, a cover arranged in front of the door frame and including a cover fixer, and a door panel arranged in front of the cover, the door panel including a first fixer and a second fixer on a rear surface of the door panel. When the door panel is coupled to a front side of the cover, the first fixer is coupled to the door frame and the second fixer is coupled to the cover.

A semiconductor package includes a first semiconductor chip including a first bonding pad on a first surface of a first substrate, a first through electrode penetrating through the first substrate and electrically connected to the first bonding pad, a first recess with a desired depth in the first substrate from a second surface of the first substrate and exposing an end portion of the first through electrode, and a second bonding pad in the first recess and electrically connected to the first through electrode, a second semiconductor chip stacked on the second surface of the first substrate and including a third bonding pad on a third surface of a second substrate, and a conductive connection member between the second bonding pad and the third bonding pad. At least a portion of the conductive connection member may be in the first recess.

Semiconductor package including semiconductor chips stacked via conductive bumps

A semiconductor device having a package on package (PoP) structure, in which a fine pitch between package substrates is implemented, a total height of a package is reduced, and reliability is enhanced. The semiconductor package includes a first package substrate including a first body layer and a first passivation layer, a first semiconductor chip on the first package substrate, a second package substrate on the first package substrate, the second package substrate including a second body layer and a second passivation layer, a first connection member on the first package substrate outside the first semiconductor chip, and a gap filler filled between the first package substrate and the second package substrate, wherein the first package substrate includes a first trench, the second package substrate includes a second trench, and the first semiconductor chip is disposed between the first trench and the second trench.

Semiconductor device having package on package structure and method of manufacturing the semiconductor device

A vacuum cooking appliance is provided. The vacuum cooking appliance may include a housing in which a housing mount and a vacuum packing module mount may be located at adjacent positions, a first container configured to accommodate liquid inside an accommodation space therein and coupled to the container mount, a heater configured to heat the liquid accommodated inside the first container, a vacuum pressure generator installed at the vacuum packing module mount and configured to suction air inside a food packing container, and a vacuum packing module installed adjacent to the vacuum pressure generator and including a sealer configured to heat.

Vacuum cooking appliance

A low-temperature vacuum cooking device and a cooking appliance including low-temperature vacuum cooking device are provided. The cooking appliance may include a housing including a container mount, a first container having a space to accommodate a liquid therein, the first container being configured to be coupled with the container mount, a heater that heats the liquid accommodated in the first container, a cover rotatably installed on the housing to cover or open the first container.

Cooking appliance

A semiconductor package includes a package substrate, an interposer, a semiconductor chip between the package substrate and the interposer, a plurality of conductive connectors between the package substrate and the interposer, and a capacitor stack structure between the package substrate and the interposer, he capacitor stack structure including a first capacitor connected to the package substrate, and a second capacitor connected to the interposer.

Semiconductor package

A semiconductor package including: a first substrate; a first semiconductor device on the first substrate; a first mold layer covering the first semiconductor device; a second substrate on the first mold layer; a support solder ball interposed between the first substrate and the second substrate, and electrically disconnected from the first substrate or the second substrate, wherein the support solder ball includes a core and is disposed near a first sidewall of the first semiconductor device; and a substrate connection solder ball disposed between the first sidewall of the first semiconductor device and the support solder ball to electrically connect the first substrate to the second substrate, wherein a top surface of the first semiconductor device has a first height from a top surface of the first substrate, and the core has a second height which is equal to or greater than the first height.

Semiconductor package including a support solder ball

A refrigerator is provided. The refrigerator includes a main body including a first door, a door opening device configured to open the first door, a first proximity sensor disposed adjacent to the first door, a first infrared sensor disposed on the first door, and at least one processor, wherein the at least one processor is configured to, based on detection data obtained by the first proximity sensor, control the door opening device to open the first door based on an external object approaching within a threshold distance from the refrigerator, and based on the external object being identified based on detection data obtained by the first infrared sensor while the first door is open, control the door opening device to stop opening of the first door.

Refrigerator with automatic door opening and controlling method thereof

A heating apparatus and a cooking apparatus including the same are disclosed. The disclosed invention comprises: a housing having an accommodation space formed therein and an opened upper part; a container, which is inserted into the accommodation space inside the housing, and has an opened upper part and a space formed therein for accommodating fluid; a heating part for heating the fluid accommodated inside the container; and a cover for covering the opened upper part of the housing, wherein the cover includes a cover main body part, which is provided to have a length extending in the longitudinal direction and a width extending in the horizontal direction, is provided at the housing so as to be rotatable between an opening position at which the opened upper part of the housing is opened and a closing position at which the opened upper part of the housing is closed, and covers the opened upper part of the container at the closing position so as to seal the container.

Heating apparatus and cooking apparatus including same

A cooking apparatus may include a housing having an open top surface and having a cooking space formed therein; a door provided on a top of the housing to open and close the cooking space; a container inserted into the housing, the container having an open top surface to receive food to be cooked therein; and a heating unit provided in the housing and contacting a bottom surface of the container to heat the container. The heating unit may include a heating unit body defining a support surface that supports the container; a heater provided in the heating unit body; and a rib that extends downward from the heating unit body to prevent water or foreign material from entering between the heating unit and a bottom of the housing.

Cooking apparatus

A refrigerator with an enhanced door includes a main body including a storeroom, first and second doors pivotally coupled to the main body to open or close the storeroom and a pivot bar pivotally installed at the first door. The pivot bar is movable between a first position between the first and second doors and a second position pivoted toward the first door to prevent cold air leaks from the storeroom. A locking device separably locks the pivot bar to the first door when the pivot bar is in the second position.

Growing community of inventors

Seoul, South Korea

Jeonghyun Lee