Semiconductor Components Industries, LLC

JeongHyuk Park

Seungwon Im

Keunhyuk Lee

Jonghwan Baek

Paolo Bilardo

Jerome Teysseyre

Power module package

Described implementations provide wireless, surface mounting of at least two semiconductor die on die attach pads (DAPs) of the semiconductor package, where the at least two semiconductor die are electrically connected by a clip. A stress buffer layer may be provided on the clip, and a heatsink may be provided on the stress buffer layer. The heatsink may be secured with an external mold material.

Dual cool power module with stress buffer layer

Implementations of semiconductor packages may include a substrate, a first die coupled on the substrate, and a lead frame coupled over the substrate. The lead frame may include a die attach pad. Implementations of semiconductor packages may also include a second die coupled on the die attach pad. The second die may overlap the first die.

Power module and related methods

Growing community of inventors

Incheon, South Korea

JeongHyuk Park