Samsung Electronics Co., Ltd.

Jeonghyeon Cho

Kyungsoo Kim

Yongsuk Kwon

Jinin So

Jonggeon Lee

Jin Woo Jung

Jonghoon Kim

Young-ho Lee

Seungjin Lee

Jong-Geon Lee

Jinseong Yun

Kyoungsun Kim

Sungjoo Park

Jonghyun Seok

Heejin Cho

Ilhan Choi

Seonghoon Joo

Ilkwon Yun

A memory module includes a device memory configured to store data and including a first memory area and a second memory area, and a controller including an accelerator circuit. The controller is configured to control the device memory, transmit a command to exclude the first memory area from the system memory map to a host processor in response to a mode change request, and modify a memory configuration register to exclude the first memory area from the memory configuration register. The accelerator circuit is configured to use the first memory area to perform an acceleration operation.

Memory module, system including the same, and operation method of memory module

An electronic device includes: a multilayered base substrate including a plurality of substrate bases stacked on each other; a first conductive via and a second conductive via penetrating the substrate bases and spaced from each other; a conductive line electrically connecting the first conductive via and the second conductive via to each other and disposed on at least one of the substrate bases of the plurality of substrate bases; and an open stub including a first end and a second end, wherein the first end is connected to a connector of the conductive line, and the second end is opened.

Electronic device having multilayered substrate and manufacturing method thereof

A memory module includes a memory substrate including a main connector and an auxiliary connector, configured to be connected to an external device; and a plurality of memory chips mounted on at least one of a first surface or a second surface of the memory substrate, wherein the main connector is disposed on one side of the memory substrate, and the auxiliary connector is disposed on the second surface of the memory substrate.

Memory module, main board, and server device

A booting method of a computing system, which includes a memory module including a processing device connected to a plurality of memory devices, including: powering up the computing system; after powering up the computing system, performing first memory training on the plurality of memory devices by the processing device in the memory module, and generating a module ready signal indicating completion of the first memory training; after powering up the computing system, performing a first booting sequence by a host device, the host device executing basic input/output system (BIOS) code of a BIOS memory included in the computing system; waiting for the module ready signal to be received from the memory module in the host device after performing the first booting sequence; and receiving the module ready signal in the host device, and performing a second booting sequence based on the module ready signal.

Booting method of computing system including memory module with processing device mounted

Memory modules and memory systems having the same are provided. A memory module may include command/address terminals, data terminals, at least one monitoring terminal, a buffer, and a plurality of semiconductor memory devices. The buffer may be configured to receive and buffer data applied through the data terminals and a command/address applied through the command/address terminals to generate buffered write data and a buffered command/address. The buffer may be configured to buffer the buffered write data and the buffered command/address to generate module data and a module command/address, and store and then transmit at least one portion of the buffered write data as monitoring data through the at least one monitoring terminal. The plurality of semiconductor memory devices may be configured to receive and store the module data in response to the module command/address.

Memory modules and memory systems having the same

A memory module includes a first memory device, a second memory device, and a processing buffer circuit that is connected to the first memory device and the second memory device (independently of each other) and a host. A processing buffer circuit is provided, which includes a processing circuit and a buffer. The processing circuit processes at least one of data received from the host, data stored in the first memory device, or data stored in the second memory device based on a processing command received from the host. The buffer is configured to store data processed by the processing circuit. The processing buffer circuit is configured to communicate with the host in compliance with a DDR SDRAM standard.

Memory modules and methods of operating same

A semiconductor memory device includes: a temperature sensor configured to sense an internal temperature of the semiconductor memory device and generate a temperature signal; and a temperature code storage unit configured to receive the temperature signal in response to a temperature code write control signal that is generated when an operation corresponding to a specific command is performed, generate an operating temperature code corresponding to the temperature signal, compare the operating temperature code with a previously stored temperature code, store a larger temperature code of the operating temperature code and the previously stored temperature code as a maximum temperature code, and output the maximum temperature code to an external source in response to a temperature code read control signal.

Growing community of inventors

Hwaseong-si, South Korea

Jeonghyeon Cho