Samsung Display Co., Ltd.

Jeonghun Go

Sangrock Yoon

Jeong-Mo Nam

Moonshik Kang

Hyo-chul Lee

Siyoung Choi

YongSoon Lee

Onsik Choi

Hyochul Lee

A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on the lower surface, and an under-fill element disposed on at least one side surface. The method further includes mounting the electronic device on a printed circuit board including connecting pads formed thereon. The bumps of the semiconductor chip body are connected to the connecting pads. The method additionally includes heating the under-fill element to a predetermined temperature to form an under-fill layer between the lower surface of the semiconductor chip body and the printed circuit board.

Electronic device having an under-fill element, a mounting method of the same, and a method of manufacturing a display apparatus having the electronic device

A display device including: a display panel; a printed circuit board (PCB) including a first substrate and a second substrate; a driving circuit disposed on the first substrate; a carrier connected between the display panel and a pad of the PCB and having a data driving integrated circuit mounted thereon; a protrusion corresponding to the pad and protruding from a side of the second substrate; and a signal line disposed in the protrusion, the first substrate, and the second substrate, the signal line for transmitting a signal from the driving circuit to the carrier.

Display device

Provided is a printed circuit board and a display device having the same. The printed circuit board includes a base substrate including a first outline that extends in a first direction and a second outline facing the first outline, the base substrate having a first area, a second area, and a third area successively defined thereon in the first direction and a pad part disposed on the second area. A central outline of the second outline which overlaps the second area has a stepped shape that gradually decreases in distance between the central outline and the first outline from a first point of the central outline contacting the first area to a second point of the central outline contacting the third area.

Printed circuit board and display device having the same

A circuit board includes a base layer, a circuit layer disposed on the base layer, where an air gap is defined in the circuit layer, a heat blocking part disposed in the air gap, and an electronic element disposed on the circuit layer. The heat blocking part has a thermal conductivity lower than a thermal conductivity of the circuit layer.

Growing community of inventors

Asan-si, South Korea

Jeonghun Go