Samsung Display Co., Ltd.

Jeongho Yi

Kyongho Hong

Dokyun Kwon

Jaebum Pahk

Jinwon Baek

Jinpyung Lee

Gyoowan Han

Cheollae Roh

Futoshi Yoshida

Toshinaru Suzuki

Seokjoo Lee

Jihun Kang

A laser apparatus including a stage. A target substrate is mounted on the stage. The laser apparatus further includes a coupling unit disposed below the stage and coupled with a conveying unit, the conveying unit conveying the stage. The laser apparatus additionally includes a discharge unit disposed at a predetermined position for laser machining, configured to communicate with the coupling unit when docked with the coupling unit, and configured to discharge foreign matter that is generated during laser machining.

Laser apparatus including fastening holes and inlet grooves

A stage for cutting a substrate includes: a body member; a plurality of first discharging members, each including a first suction portion in the body member and a first partition wall portion connected to the first suction portion and protruding from a top surface of the body member, each of the first discharging members defining a first space connected to an outside; a plurality of second discharging members, each including a second suction portion in the body member and a second partition wall portion connected to the second suction portion and protruding from the top surface of the body member, each of the second discharging members defining a second space connected to the outside; a plurality of connecting pipes each connected to the first partition wall portion and the second partition wall portion; and a plurality of supply pipes connected to the connecting pipes.

Stage for cutting substrate and substrate cutting device

A substrate processing apparatus includes the following: a support frame, first stage, a suction part, and a plurality of island-type second stages. The support frame is disposed on the first stage. The height of the support frame is lower than the height of the first stage. A plurality of island-type second stages are disposed on the support frame on the same plane as the first stage. The suction part is disposed on the support frame.

Substrate processing apparatus and substrate processing method

Embodiments of the present disclosure provide a robot arm apparatus including a fastener for fastening a first electronic component to a second electronic component, and a movable part configured to move the fastener. The fastener includes an arm connected to the movable part, a head connected to the arm and configured to contact the first electronic component, and a lock configured to be in contact with the arm when the first electronic component is moved to a reference space, and to be spaced apart from the arm when the first electronic component is fastened to the second electronic component after the first electronic component is moved to the reference space.

Robot arm apparatus

A particle removal device includes: a stage on which a target substrate is disposed; an inner case defining a first discharge opening through which the stage is exposed to an internal space of the inner case; an outer case including: a side wall portion surrounding the inner case, a protrusion portion protruded from the side wall portion toward the inner case, and a second discharge opening in fluid connection with the first discharge opening; a suction pump connected to the second discharge opening; an air injector in fluid connection with the internal space; and an intake opening in fluid connection with the first and second discharge openings. A width of the intake opening as a distance between the distal end of the inner case and the distal end of the protrusion portion is smaller than a width of the first discharge opening.

Growing community of inventors

Suwon-si, South Korea

Jeongho Yi