Samsung Electronics Co., Ltd.

Jeongho Ahn

Dongchul Ihm

Chungsam Jun

Dongryul Lee

Doyoung Yoon

Seongsil Lee

Chulkwi Kim

Yusin Yang

Seulji Song

Jin Sagong

Bo-ram Namgoong

Sungnam Kang

Hidong Kwak

Sunyoung Song

Minji Jeon

Hyungsuk Cho

Hyunwoo Ryoo

Jae-Man Oh

Jungyouel Bang

An electronic device is provided. The electronic device includes a memory, a battery, a speaker, a communication module, and at least one processor electrically connected to the memory, the battery, the speaker, and the communication module, wherein the at least one processor is configured to receive information indicating a wearing position from an external electronic device, and determine, based on the information indicating the wearing position of the external electronic device, whether to operate as a primary device among multiple electronic devices.

Method for controlling electronic devices and electronic device thereof

A semiconductor-device inspection apparatus includes a stage configured to allow a measurement target to be placed thereon, an actuator configured to move the stage in a vertical direction, a detector configured to detect a plurality of Raman spectra from scattered light that has been scattered away from the measurement target, and a processor configured to generate a plurality of spectral images for a measurement variable by using the plurality of Raman spectra detected by the detector, wherein the detector is further configured to detect the plurality of Raman spectra at different vertical levels of the measurement target.

Apparatus and method for inspecting semiconductor device

A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.

Inspection system of semiconductor wafer and method of driving the same

In accordance with certain embodiments of the disclosure, an electronic device comprises a communication circuitry configured to transmit or receive a first wireless communication signal to an external device in a first communication scheme; a memory; and a processor, wherein the processor is configured to: scan for a second wireless communication signal by a second communication scheme proximate to the electronic device; operate in a first mode of controlling a transmission power of the first wireless communication signal based on receive sensitivity for the first wireless communication signal of the external device, when the second wireless communication signal is determined to interfere less than an interference level with the first communication scheme; and operate in a second mode of transmitting the first wireless communication signal at a higher transmission power than the first mode, when the second wireless communication signal is determined to interfere in excess of the interference level with the first communication scheme.

Electronic device for performing wireless communication and wireless communication method

A substrate inspection system includes a substrate support, optics configured to irradiate a patterned structure on the substrate and capture images of the patterned structure from light reflected from the patterned structure, a focus adjustment operative to adjust a focal position of the incident light on the patterned structure, and an image processor configured to calculate an optimal value of a focus offset used to establish focal points of the light for defect detection in the patterned structure. The patterned structure may include a first pattern having an opening and a second pattern having top surfaces located at different heights relative to the substrate. The value of the focus offset is determined using images of the top surfaces of the second pattern obtained while changing the focal position of the incident light.

System and method of inspecting substrate and method of fabricating semiconductor device using the same

An electronic device and a method for controlling an external electronic device connected to the electronic device through wireless communication are provided herein. A first electronic device includes a communication module configured to communicate with a second electronic device; and a processor configured to, in response to an entry event of a communication restriction mode in which at least one communication function of the first electronic device is deactivated, provide entry information of the communication restriction mode and release information of the communication restriction mode to the second electronic device, and control performance of the communication restriction mode using the entry information and the release information.

Method for controlling external electronic device and electronic device for processing same

A substrate inspection apparatus may include a light source, which is configured to emit an incident light. The substrate inspection apparatus may further include a support, a detector, and a light adjuster. The supporting base configured to support a substrate, the detector configured to detect a defect on the substrate, and the light adjuster configured to allow the incident light to be reflected. The detector may be configured to collect a scattering signal. The scattering signal is generated from an optical interaction between an evanescent wave and the defect on the substrate, and to detect the defect. The evanescent wave may be generated when the incident light is totally and/or substantially reflected by the light adjuster.

Growing community of inventors

Hwaseong-si, South Korea

Jeongho Ahn