Samsung Electronics Co., Ltd.

Jeongheon Park

Whankyun Kim

Sechung Oh

Jaehoon Kim

Younghyun Kim

Joonmyoung Lee

Junho Jeong

Woo Chang Lim

Sang Hwan Park

Sangyong Kim

Sanghwan Park

A magnetic device includes a seed pattern, a reference magnetic structure on the seed pattern, a free magnetic pattern on the reference magnetic structure, and a tunnel barrier between the reference magnetic structure and the free magnetic pattern. The reference magnetic structure includes a synthetic antiferromagnetic (SAF) structure including a first fixed pattern in contact with an upper surface of the seed pattern, an antiferromagnetic coupling pattern in contact with an upper surface of the first fixed pattern, and a second fixed pattern in contact with an upper surface of the antiferromagnetic coupling pattern; a nonmagnetic pattern in contact with an upper surface of the second fixed pattern; and a polarization reinforcement magnetic pattern in contact with an upper surface of the nonmagnetic pattern.

Magnetic device

An apparatus for manufacturing a semiconductor device includes first and second process chambers in a first row in a first direction, third and fourth process chambers in a second row in the first direction, the third and fourth process chambers being spaced apart from the first and second process chambers in a second direction, and the first and third process chambers being arranged in parallel in the second direction to perform a same process, a load-lock chamber at one side of the first to fourth process chambers in the first direction, and first and second transfer chambers directly connected to each other in a third row in the first direction, the third row being between the first and second rows, and each of the first and second transfer chambers including a transfer unit to transfer a semiconductor substrate between the first to fourth process chambers and the load-lock chamber.

Apparatus for manufacturing semiconductor device

A magnetic memory device according to embodiments includes a first reference magnetic layer on a substrate, a second reference magnetic layer on the first reference magnetic layer, a free layer between the first reference magnetic layer and the second reference magnetic layer, a first tunnel barrier layer between the first reference magnetic layer and the free layer, and a second tunnel barrier layer between the second reference magnetic layer and the free layer. The first reference magnetic, second reference magnetic and free layers each have a magnetization direction substantially perpendicular to a top surface of the substrate. A resistance-area product (RA) value of the first tunnel barrier layer is greater than that of the second tunnel barrier layer.

Magnetic memory devices

Growing community of inventors

Hwaseong-si, South Korea

Jeongheon Park