Samsung Electronics Co., Ltd.

Jeonggen Yoon

Kyungwoon Jang

Youngjun Moon

Min Cheol Park

Changjoon Lee

Gyun Heo

Soonmin Hong

Tackmo Lee

Gyuhwa Kim

Won Suk Choi

Byunghoon Lee

Hyun-Tae Jang

Youngchul Lee

Hyuntae Jang

Minyoung Park

Jiyoung Jang

Byung Hoon Lee

Siho Jang

According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.

Electrical element transfer apparatus

A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.

Display module having glass substrate on which side wirings are formed and manufacturing method of the same

Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.

Transfer apparatus of an electronic component

Growing community of inventors

Suwon-si, South Korea

Jeonggen Yoon