Cheil Industries Inc.

Jeong Won Lee

Jong Cheol Lim

Chan Gyun Shin

Nam Hyun Kim

Eun Joo Lee

Hoo Seok Lee

An integrated LED lamp housing can include a heat radiation section and a light transmission section. The integrated LED lamp housing can be prepared by co-extruding different polycarbonate resin compositions.

Tubular integrated light emitting diode (LED) lamp housing having a heat radiation section and a light transmission section and method for making the same

A thermoplastic resin composition comprises (A) about 30 to about 50% by weight of a thermoplastic resin, and (B) about 50 to about 70% by weight of a spherical magnesium oxide, wherein the thermal diffusivity of the thermoplastic resin composition in the horizontal or vertical direction is about 0.065 to about 0.20 cm/sec and the ratio of thermal diffusivity of the horizontal direction:vertical direction is about 1:0.5 to about 1:1. A thermoplastic resin composition according to a second embodiment comprises (A) about 30 to about 50% by weight of a thermoplastic resin, and (B) about 50 to about 70% by weight of a spherical magnesium oxide, wherein the spherical magnesium oxide is treated on its surface with a silane compound.

Thermoplastic resin composition having improved thermal conductivity and articles thereof

A polyphenylene sulfide resin composition comprises (A) about 30 to about 50% by weight of a polyphenylene sulfide resin; (B) about 1 to about 5% by weight of an amorphous polyamide resin; and (C) about 45 to about 69% by weight thermally conductive insulating fillers.

Polyphenylene sulfide resin composition with improved thermal conductivity and surface appearance and articles thereof

Disclosed is a thermally conductive resin composition including (A) about 40 to about 70% by weight of polyphenylene sulfide based resin; (B) about 20 to about 30% by weight thermally conductive graphite; and (C) about 10 to about 30% by weight milled pitch based carbon fiber. The resin composition can have excellent thermal conductivity by improving thermal conductivity in a plane-direction and thermal conductivity in a Z-direction and also can have commercially usable impact strength.

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Busan-si, South Korea

Jeong Won Lee