Skhynix Inc.

Hynix Semiconductor Inc.

Jeong-Tae Hwang

Jeong-Hun Lee

Jung-Hyun Kim

Sang-Ah Hyun

Joon-Woo Choi

Woongrae Kim

Jong-Hyun Park

Yong-Mi Kim

Sang-Kwon Lee

Jae-Hoon Cha

Mi-Hyun Hwang

Woo-Young Lee

Jong-Ho Son

Seung-Wook Oh

Ja-Beom Koo

Duck-Hwa Hong

A memory system includes a first memory and a second memory that share common addresses received from a memory controller, wherein the first memory includes a first scrambling circuit suitable for scrambling a common address to generate a first scrambled address designating a word line to be activated in the first memory, and the second memory includes a second scrambling circuit suitable for scrambling the common address to generate a second scrambled address designating a word line to be activated in the second memory, and the first scrambling circuit and the second scrambling circuit perform a scrambling operation in such a manner that neighboring word lines, adjacent to a word line selected by a first common address, are selected a most in one memory among the first memory and the second memory by a second common address other than the first common address.

Memory system

A memory module includes: a plurality of memories, wherein each of the memories comprises: an encryption key storage circuit suitable for storing an encryption key; an address encryption circuit suitable for generating an encrypted address by encrypting an address transferred from a memory controller by using the encryption key stored in the encryption key storage circuit; and a cell array accessed by the encrypted address, wherein the encryption key storage circuits of the memories store different encryption keys.

Memory module, operation method of memory module, memory system, and operation method of memory system

A memory device may include first and second latch sections configured to respectively store a target address and a recent input address, a comparison unit configured to compare an input address with the target address and the recent input address respectively stored in the first and second latch sections, and output a resultant signal, a counting section configured to increase a count corresponding to the recent address stored in the second latch section in response to the resultant signal, and a control unit configured to check the count of the counting section and update the input address to the second latch section in response to the resultant signal.

Memory device, memory system including the same, and address counting and comparing operation for refresh operation method thereof

A semiconductor device includes a fuse array section suitable for performing program and read operations; a control signal generation section suitable for generating a precharge control signal and a word line control signal; a bit line control section suitable for controlling a precharge operation of a bit line in response to the precharge control signal and a source signal; and a word line control section suitable for controlling activation of a program word line and a read word line for performing the program and read operations in response to the word line control signal, wherein the control signal generation section controls the word line control signal to be activated after a predetermined time from the activation of the precharge control signal.

Semiconductor device and method for operating the same

A semiconductor memory device includes: a high frequency signal control unit for receiving an external command address signal, removing noise and glitch from the external command address signal and outputting a first command address signal; a pulse width control unit for controlling a pulse width of the first command address signal or maintaining the pulse width of the first command address signal and outputting a second command address signal with a predetermined pulse width; a refresh operation control unit for generating a row address for a refresh operation in response to the second command address signal; and a memory cell array for performing the a refresh operation in response to the row address.

Semiconductor memory device and method for operating the same

An integrated circuit may include nonvolatile memory suitable for outputting stored data during the boot-up operation, one or more registers suitable for receiving the data output by the nonvolatile memory and storing the received data when the boot-up operation is performed, and one or more internal circuits suitable for operating using the data stored in the one or more registers. In no-update mode, although the boot-up operation is performed, a data update from the nonvolatile memory to the registers may not be performed.

Integrated circuit and memory device performing boot-up operation

A memory device may include a plurality of memory banks; a setting circuit capable of setting at least one of an advanced refresh mode and a piled refresh mode; and a refresh control unit capable of controlling the plurality of memory banks into a plurality of groups and for activating the plurality of groups to be refreshed at different times when a refresh command is applied, wherein the refresh control unit divides the memory banks into first groups determined based on the piled refresh mode and refreshes the first groups once, while, in the advanced refresh mode, the refresh control unit divides the memory banks into second groups determined based on the piled refresh mode and additional setting information and refresh the second groups a first number of times, which is more than two and determined based on the additional setting information.

Memory device

A semiconductor device including an input unit suitable for transferring external command signals provided from an external device to an internal device and a detection unit suitable for detecting a predetermined command signal among the external command signals, and restricting the transfer of the detected command signal.

Semiconductor device and operating method thereof

A semiconductor memory device includes: a normal cell region having normal cells; a redundancy cell region having first redundancy cells replaced with repair target cells of the normal cells and second redundancy cells which are not replaced with the repair target cells; a fuse unit suitable for programming repair information including replacement information and one of state information and a repair address of the repair target cells; a boot-up unit suitable for outputting the repair information programmed in the fuse unit, resetting the repair information in response to a test control signal, and outputting the reset repair information; an information update unit suitable for generating the test control signal; a test control unit suitable for generating a test address during a redundancy test operation; and a test unit suitable for selectively testing the second redundancy cells in response to the test address.

Semiconductor memory device and test method thereof

A semiconductor device includes a fuse array for storing normal fuse data and pattern data through a programming operation, a boot-up control unit suitable for generating an enable signal for enabling an output of the pattern data, and a pattern detection unit suitable for detecting a pattern of the pattern data in response to the enable signal, and generating a detection signal. The fuse array outputs the normal fuse data in response to the detection signal.

Semiconductor device with fuse array and operating method thereof

An operation method of a semiconductor memory device including a fuse array for storing one or more repair addresses includes latching additionally a repair address having an address value, which is not stored in the fuse array in response to an active command signal during a repair operation mode, receiving a repair entry control code from an external device in response to a first column command signal during the repair operation mode, performing a rupture operation of the repair address, which is latched, in response to a second column command signal, wherein the rupture operation is determined based on a value of a repair entry control code, and performing exit of the repair operation mode in response to a precharge command signal, which is provided after the second column command signal.

Semiconductor memory device, semiconductor memory module and operation methods thereof

An self-refresh control circuit for controlling a self-refresh operation of a memory device includes a self-refresh control logic block configured to control the memory device to perform the self-refresh operation and an initial refresh control block configured to activate the self-refresh control logic block in an initialization period of the memory device.

Self-refresh control circuit and memory including the same

A bank selection circuit includes a command latch unit configured to latch an input command at a time earlier than a rising edge of a clock by a setup time, a command decoder configured to decode a latched command and generate a row operation signal, a bank address latch unit configured to latch an input bank address at a time earlier than the rising edge of the clock by the setup time, a bank address decoder configured to decode a latched bank address and generate a bank selection signal, and a bank selection unit configured to receive the row operation signal and the bank selection signal and transfer the row operation signal to a bank selected by the bank selection signal.

Bank selection circuit and memory device having the same

A delay circuit includes a delay unit configured to generate a delayed transfer signal by delaying a transfer signal corresponding to a first signal or a second signal, a distinguishment signal generation unit configured to generate a distinguishment signal which represents to what signal the transfer signal correspond between the first signal and the second signal and a delayed signal generation unit configured to output the delayed transfer signal as a first delayed signal or a second delayed signal in response to the distinguishment signal.

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Gyeonggi-do, South Korea

Jeong-Tae Hwang