Samsung Electro-Mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Jeong Suong Yang

Yun Sung Kang

Sung Min Cho

Shigenobu Maeda

Sang Jin Kim

Bon Seok Koo

Woong Do Jung

Tae Kyung Lee

Seung Mo Lim

Sung Woo Han

Hwa Sun Lee

Jin Suk Son

Ran Hee Shin

Yeong Gyu Lee

Sung Sun Kim

Bo Sung Ku

Eun Tae Park

Kwang Su Kim

Jong Hyeong Song

Jeong Il Lee

Pil Joong Kang

Jong Suk Han

Byeong Cheol Moon

Tae Ho Kim

Jung Min Kim

Ju Hwan Yang

Jung Won Lee

Byung Soo Kang

No Il Park

Tae Joon Park

Hai Joon Lee

Tae Jun Choi

Ho Joon Park

Seung Hun Han

Kyo Yeol Lee

Sang Wook Lee

Tai Yon Cho

Seung Joo Shin

Ho Phil Jung

Yoon Mi Cha

Chang Soo Jang

Hyun Kee Lee

Soo Young Ji

Sang Hyun Yi

Ji Hye Nam

Junga Choi

Sang Youl Jeon

Hyung Goo Baek

Hwan Soo Yoo

Nam Soon Moon

Dae Chul Choi

An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.

Acoustic resonator and method of manufacturing the same

An electronic component includes an electronic component main body including a body and an external electrode disposed on the body. The body includes a dielectric layer and an internal electrode. The electronic component further includes a coating portion including a coating layer, disposed on an external surface of the electronic component main body, and a plurality of projections disposed on the coating layer.

Electronic component and method for manufacturing the same

A coil component includes a body having a bottom surface and a top surface opposing each other in one direction, and a plurality of walls each connecting the bottom surface to the top surface of the body; recesses respectively formed in both front and rear surfaces of the body opposing each other among the plurality of walls of the body and extending up to the bottom surface of the body; a coil portion buried in the body and including first and second lead-out portions exposed to internal walls and lower ledge surfaces of the recesses; first and second external electrodes respectively including connection portions disposed in the recesses and extended portions disposed on the bottom surface of the body, and connected to the coil portion; a shielding layer including a cap portion disposed on the top surface of the body and side wall portions respectively disposed on the plurality of walls of the body; and an insulating layer disposed between the body and the shielding layer and extending onto lower ledge surfaces and internal walls of the recesses to cover the connection portions.

Coil component

A capacitor component includes: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween; first and second external electrodes including first and second connection portions, and first and second band portions extending onto portions of a surface from the first and second connection portions, respectively; first and second plating layers disposed on the first and second band portions, respectively; humidity resistant layers disposed between the first and second external electrodes, disposed on the first and second external electrodes, and having openings respectively exposing portions of the first and second band portions. The first and second plating layers are disposed in the openings of the humidity resistant layers, respectively, and are in contact with the first and second band portions, respectively.

Capacitor component

A capacitor component includes a humidity resistant layer formed on a portion of the external surface of a body on which an external electrode is not formed, and further includes a humidity resistant layer disposed inside the external electrode, to improve humidity resistance reliability. The capacitor component includes an opening portion formed by removing a portion of the humidity resistant layer disposed inside the external electrode to improve electrical connection.

An acoustic resonator includes a substrate having via holes provided therein and having a membrane structure formed on a first surface of the substrate, and a cap accommodating the membrane structure and bonded to the substrate. The cap includes a support block in contact with the membrane structure.

Acoustic resonator and method for manufacturing the same

The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.

Electronic element package and method for manufacturing the same

A capacitor component includes a dielectric including a first main surface and a second main surface facing each other, and at least one end surface that connects the first main surface and the second main surface, the dielectric being vertically disposed by positioning the at least one end surface on a lower surface of the capacitor component, and a first electrode and a second electrode that are disposed on the first main surface and the second main surface of the dielectric, respectively, wherein a size of each of the first electrode and the second electrode is greater than a size of the dielectric.

Capacitor component and method of manufacturing the same

An acoustic wave device includes an acoustic wave generator formed on one surface of a substrate; a support member formed on the one surface of the substrate spaced apart from the acoustic wave generator; a protective member coupled to the support member and disposed to be spaced apart from the acoustic wave generator; and a sealing part encapsulating the protective member and the support member, wherein the sealing part includes one, or a plurality of, first hermetic layer(s) and one, or a plurality of, second hermetic layer(s), and the first hermetic layer(s) and the second hermetic layer(s) are alternately stacked.

Acoustic wave device and method of manufacturing the same

An aerogel capacitor includes: a substrate including a capacitor structure including an aerogel, a dielectric layer and a conductive layer, and a support surrounding the capacitor structure; and an electrode unit including a first electrode and a second electrode provided on the substrate. The first electrode is connected to the aerogel and the second electrode is connected to the conductive layer.

Aerogel capacitor and method for manufacturing the same

An electronic component includes: a body having electrical insulating properties; an external electrode disposed on an external surface of the body; and a reinforcing layer disposed on a surface of the body and including a metal oxide layer and a graphene oxide layer.

Electronic component and system-in-package

An acoustic wave filter device includes a base having an acoustic wave filter part and a bonding part disposed thereon, the bonding part surrounding the acoustic wave filter part, and a cap having a bonding counterpart disposed thereon, the bonding counterpart being bonded to the bonding part of the base, and the bonding part includes a first bonding layer including gold, and the bonding counterpart includes a second bonding layer bonded to the first bonding layer and including tin.

Acoustic wave filter device and package and method of manufacturing the same

Disclosed herein is a polling system, including: a matrix element including individual elements including upper electrodes and lower electrodes, the individual elements being arrayed in plural, the upper electrodes of the individual elements being each connected in series to form upper electrode units which are arrayed in plural and the lower electrodes of the individual elements being each connected in series to form lower electrode units which are arrayed in plural; an upper switch connected to each of the upper electrode units which is arrayed in plural; a lower switch connected to each of the lower electrode units which is arrayed in plural; and a polling unit performing polling to apply voltage to the upper electrodes and the lower electrodes, respectively.

Polling system and polling method using the same

Disclosed herein is a chip for inspecting toxicity and efficacy, including: a first substrate including fitting holes formed at corners thereof; and a second substrate including gap forming members formed at corners thereof corresponding to the fitting holes to form a gap between the first substrate and the second substrate, and protrusions formed on the gap forming members corresponding to the fitting holes and fitted in the fitting holes. The chip for inspecting toxicity and efficacy is advantageous in that alignment of the chip can be easily performed, in that problems with the emission of fluorescence or the penetration of measuring light in the chip can be solved, and in that the cost of producing the chip can be reduced.

Chip for inspecting toxicity and efficacy

Growing community of inventors

Suwon-si, South Korea

Jeong Suong Yang