Samsung Display Co., Ltd.

Jeong-Seop Choi

Seung Hwan Kim

Young Su Kim

Byung Hoon Kang

Jeong Ho Hwang

Young-Seok Seo

Seung Ho Kim

Gyu In Shim

Youngsu Kim

Jae Suk Yoo

Jaesuk Yoo

Kyung Rok Ko

Yong Won Yun

Kisang Yoo

Kyungrok Ko

Jungkyu Lee

Jongdeok Park

A bonding device includes: a support in which a plurality of through-holes is defined, a diaphragm disposed on the support to cover the support, a pressing pad disposed on the diaphragm over a top surface of the support, and a window fixing chuck disposed on the pressing pad and in which a groove facing the pressing pad is defined. Here, the pressing pad includes a pad and at least one support bar disposed in the pad and extending in a first direction.

Bonding device and method of manufacturing display device using the same

Cover window

A bonding device includes a first panel support, a second panel support disposed below the first panel support, a diaphragm disposed on and extending along the first panel support, the diaphragm being disposed between the first panel support and the second panel support, and a window fixing chuck disposed on the diaphragm, the window fixing chuck including a groove facing the diaphragm. A through-hole extends from the second panel support to the first panel support, and the diaphragm is disposed on the through-hole.

Support, bonding device including support, and method of manufacturing display device using the same

Cover window for display device

Growing community of inventors

Cheonan-si, South Korea

Jeong-Seop Choi