Electronics and Telecommunications Research Institute

Jeong-Rae Ro

El-Hang Lee

Sung-Bock Kim

Seong-Ju Park

Seong-Bock Kim

An epitaxial growth method for a compound semiconductor thin film, capable of forming a p-n junction with an atomic-scale ultra-micro structure is disclosed. The method involves loading the compound semiconductor substrate in a reaction chamber, injecting Group V and III metal organic source gases not processed by a thermal pre-decomposition process into the reaction chamber, and growing a p- or n-type compound semiconductor on the compound semiconductor substrate while adjusting the growth temperature of the p- or n-type compound semiconductor.

Formation of InGaSa p-n Junction by control of growth temperature

Disclosed is a fabricating method of a GaAs substrate having a V-shaped groove in a higher density, that is a double density, the method comprising the steps of forming a Si.sub.3 N.sub.4 layer on a main surface of the GaAs substrate; patterning the Si.sub.3 N.sub.4 layer using a photo-lithography to form a patterned Si.sub.3 N.sub.4 layer having a minimum width; wet-etching the GaAs substrate using the patterned Si.sub.3 N.sub.4 layer as a mask, so as to form (111) and (100) surfaces of the GaAs substrate beneath the patterned Si.sub.3 N.sub.4 ; selectively growing a GaAs film on the GaAs substrate etched thus using the patterned Si.sub.3 N.sub.4 layer as a mask so as to form the GaAs film with two (111) facets only on a (100) surface of the GaAs substrate; and removing the Si.sub.3 N.sub.4 layer. The V-shaped grooves can be formed on a GaAs substrate utilizing a difference of growth rate caused by surface orientation of the substrate, and therefore the grooves can be formed in double density.

Fabricating method of GaAs substrate having V-shaped grooves

A crystal growth method for a compound semiconductor is capable of forming a plurality of quantum wells (formed of a barrier layer having a large energy band gap and an active layer having a small energy band gap) on the compound semiconductor substrate. After etching a V-shaped groove having a (111) surface with a predetermined angle .theta.1 with respect to the (100) surface on the GaAs semiconductor substrate, the substrate is further etched by a hydrochloric solution and a solution of H.sub.2 SO.sub.4 :H.sub.2 O.sub.2 :H.sub.2 O=20:1 to cause the V-shaped groove walls to become a non-(111) surface having a lower predetermined slope angle .theta.2. The quantum wells then grown in the bottom of the V-shaped groove will be effectively disconnected from simultaneous growths on the side walls of the groove thus giving rise to closely controlled multi-dimensional quantum well structures.

Growing community of inventors

Daejeon, South Korea

Jeong-Rae Ro