Samsung Display Co., Ltd.

Jeong-Mo Nam

Sangrock Yoon

Jeonghun Go

Sung-dong Park

Mikyung Kang

Myeong-Eon Lee

Sun-mi Son

A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on the lower surface, and an under-fill element disposed on at least one side surface. The method further includes mounting the electronic device on a printed circuit board including connecting pads formed thereon. The bumps of the semiconductor chip body are connected to the connecting pads. The method additionally includes heating the under-fill element to a predetermined temperature to form an under-fill layer between the lower surface of the semiconductor chip body and the printed circuit board.

Electronic device having an under-fill element, a mounting method of the same, and a method of manufacturing a display apparatus having the electronic device

A display apparatus includes first and second substrates, a first side sealing layer, a ground connecting part, a flexible film, a driving circuit substrate, and a backlight assembly. The first substrate includes sides extending in a first and a second direction. The second substrate is disposed opposite to the first substrate and is larger in the second direction. The second substrate includes a thin film transistor, a ground wiring and first to fourth side surfaces. The first side sealing layer is disposed on the fourth side surface. The ground connecting part is disposed on the second substrate and is electrically connected to the ground wiring and the first side sealing layer. The flexible film is connected to the second substrate. The driving circuit substrate is connected to the flexible film. The backlight assembly is disposed between the driving circuit substrate and the first substrate.

Display apparatus including a backlight assembly

Provided is a method of manufacturing a display apparatus. The method includes: preparing a printed circuit board including a first printed circuit unit and a second printed circuit unit; providing, on the printed circuit board, a connection member electrically connecting the first printed circuit unit to the second printed circuit unit; coupling one end of a tape carrier package to the printed circuit board; coupling the other end of the tape carrier package to a display panel; and cutting the printed circuit board into the first printed circuit unit and the second printed circuit unit that move relative to each other.

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Incheon, South Korea

Jeong-Mo Nam