Samsung Electronics Co., Ltd.

Jeong Mln Na

Hyun Phill Ko

Sung Ki Kim

Jae Moon Jo

Chang Yeon Won

The present disclosure provides a transducer support, ultrasound probe, and ultrasound imaging apparatus. The ultrasound transducer support includes a first layer having first areas in which heat transfer materials are arranged and second areas in which sound absorbent materials are arranged, the first and second areas being arranged alternately; and a second layer having third areas located below the first areas in which sound absorbent materials are arranged and fourth areas located below the second areas in which heat transfer materials are arranged.

Growing community of inventors

Seoul, South Korea

Jeong Mln Na