Hyundai Motor Company

Kia Motors Corporation

Jeong Min Son

Jun Hee Park

Woo Yong Jeon

Sung Won Park

A power module having dual-sided cooling is provided with a semiconductor chip between an upper board and a lower board of the power module. In particular, the upper board includes: a first bonding layer made of a dielectric material, and a first electrode made of a copper material and provided on a first surface of the first bonding layer, and the first electrode is connected to the semiconductor chip. The lower board includes: a second bonding layer made of a dielectric material, and a second electrode made of a copper material and provided on a first surface of the second bonding layer, and the second electrode is connected to the semiconductor chip. More specifically, a thickness of the first electrode is greater than a thickness of the first bonding layer, and a thickness of the second electrode is greater than a thickness of the second bonding layer.

Power module having dual-sided cooling

A signal block and a double-faced cooling power module that uses the signal block is provided. The signal block includes a plurality of signal clips that are formed in a ribbon shape to connect a first signal pad formed on a semiconductor chip and a second signal pad formed on a signal lead frame. An insulator fixes the position of the plurality of signal clips while spacing the signal clips apart from each other.

Growing community of inventors

Seongnam-si, South Korea

Jeong Min Son