Samsung Electronics Co., Ltd.

Jeong Min Na

Sung Ki Kim

Ho Chang Lee

Kyeong Bin Lim

Sung Hyup Kim

Ja Eung Koo

Chang Yeon Won

Hyo Ju Kim

Young Seok Jang

Hyeon Dong Song

Kuen Byul Kim

Jin Suk Hong

Chang Gil Ryu

Eun Seok Lee

Jae Moo Jo

A semiconductor device including: a substrate; a via which penetrates the substrate; a via insulating film formed along an inner wall of the via; and a core plug which fills the via, wherein a residual stress of the via insulating film is 60 MPa to −100 MPa.

Semiconductor device and a manufacturing method thereof

A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.

Polishing pad conditioning apparatus

A semiconductor device including: a substrate; a via which penetrates the substrate; a via insulating film formed along an inner wall of the via; and a core plug which fills the via, wherein a residual stress of the via insulating film is 60 MPa to &#x2212;100 MPa.

Growing community of inventors

Seoul, South Korea

Jeong Min Na