Samsung Electro-mechanics Co., Ltd.

Seoul National University

Sungkyunkwan University

Wits Co., Ltd.

Jeong Ki Ryoo

Nam Ki Kim

Ju Hyoung Park

Dae Ki Lim

Myeong Woo Han

Kyu Bum Han

Won Cheol Lee

Hong In Kim

Sang Hyun Kim

Jae Min Keum

Sung Yong An

Jae Yeong Kim

Sung Nam Cho

Seung Goo Jang

Young Kyoon Im

Dong Ok Ko

Shin Haeng Heo

Eun Young Jung

Jung Suek Oh

Chang Hak Choi

Young Sik Hur

Thomas A Kim

Keum Cheol Hwang

Jong Lae Kim

Jung Woo Seo

Kyung In Kang

Jae Hyuk Jang

Byeong Cheol Moon

Sang Jong Lee

Dae Seong Jeon

Sung Woo Lee

Jung Young Cho

Soon Kwang Kwon

Nam Heung Kim

Seong Hee Choi

Hyeon Gil Nam

Seung Hun Ryu

Hyung Ho Seo

Yong Serk Kim

Min Hoon Kim

In Seop Yoon

An antenna apparatus includes a dielectric layer; a patch antenna pattern disposed on an upper surface of the dielectric layer and including an upper surface having a polygonal shape, a plurality of feed vias respectively disposed to penetrate the dielectric layer by at least a portion of a thickness of the dielectric layer, respectively disposed to be biased toward a first side and a second side, different from each other, from a center of the polygonal shape of the patch antenna pattern, and respectively disposed to be spaced apart from the patch antenna pattern, and a plurality of feed patterns respectively electrically connected to an upper end of a corresponding feed via, among the plurality of feed vias, respectively disposed to be spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein the polygonal shape of the patch antenna pattern has a structure in which the first side and a third side between the first and second sides form an obtuse angle, and the third side and the second side form an obtuse angle.

Antenna apparatus

An antenna apparatus includes a patch antenna pattern; a first feed via to feed power to the patch antenna pattern in a non-contact manner on a first side of the patch antenna pattern; and a plurality of feed patterns disposed on the first side of the patch antenna pattern on different levels and overlapping each other, and including at least one feed pattern that is electrically connected to the first feed via, and each having a width greater than a width of the first feed via and a cross-sectional area smaller than a cross-sectional area of the patch antenna pattern.

An antenna apparatus includes a ground plane, a patch antenna pattern disposed on an upper surface of the ground plane, a feed via penetrating the ground plane and spaced apart from the patch antenna pattern, and a coiled feed pattern electrically connected to an upper end of the feed via, spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein at least a portion of the coiled feed pattern is coiled, wherein the patch antenna pattern includes an aperture portion corresponding to the coiled feed pattern.

A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.

Chip antenna module

An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.

Antenna module

An antenna apparatus includes a first patch antenna pattern comprising a through-hole, a second patch antenna pattern disposed above the first patch antenna pattern and spaced apart from the first patch antenna pattern, a first feed via electrically connected to the first patch antenna pattern, a second feed via penetrating through the through-hole of the first patch antenna pattern, and a feed pattern disposed between the first patch antenna pattern and the second patch antenna pattern, and having one end connected to the second feed via, and another end connected to the second patch antenna pattern at a point closer to an edge of the second patch antenna pattern than the second feed.

An antenna apparatus includes a ground plane, a plurality of first patch antenna patterns arranged on a level higher than the ground plane and each configured to transmit and/or receive a first radio frequency signal of a first frequency, a plurality of second patch antenna patterns arranged on a level higher than the ground plane and each having a size smaller than a size of each of the first patch antenna patterns, wherein the plurality of second patch antenna patterns include at least one feed patch antenna pattern configured to transmit and/or receive a second radio frequency signal of a second frequency different from the first frequency, and at least one dummy patch antenna pattern which is not fed any of the first and second radio frequency signals.

An antenna apparatus includes first dipole antenna patterns, feed lines, a first ground plane, and a first blocking pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed on a side of the first dipole antenna patterns and spaced apart from each of the first dipole antenna patterns. The first blocking pattern, connected to and extending from the first ground plane, is disposed between adjacent ones of the first dipole antenna patterns.

An antenna apparatus may include: first patch antenna patterns arrayed in an N&#xd7;1 structure, the first patch antenna patterns each having a polygonal shape having an oblique side with respect to an array direction of the N&#xd7;1 structure; feed vias electrically connected to the first patch antenna patterns; and guide vias arrayed along the oblique side, wherein N is a natural number greater than or equal to 2.

An antenna apparatus includes a feed via, a patch antenna pattern which is electrically connected to a first end of the feed via, a plurality of first conductive array patterns, respectively disposed to be spaced apart from the patch antenna pattern and arranged to correspond to at least a portion of a side boundary of the patch antenna pattern, and a first conductive ring pattern spaced apart from the patch antenna pattern and the plurality of conductive array patterns and configured to surround the patch antenna pattern and the plurality of conductive array patterns.

Antenna apparatus and antenna module

An antenna apparatus includes a ground pattern having a through-hole; an antenna pattern disposed above the ground pattern and configured to either one or both of transmit and receive a radio-frequency (RF) signal; a feed via penetrating through the through-hole and having one end electrically connected to the antenna pattern; and a meta member comprising a plurality of cells repeatedly arranged and spaced apart from each other, each of the plurality of cells comprising a plurality of conductive patterns, and at least one conductive via electrically connecting the plurality of conductive patterns to each other, wherein the meta member is disposed along at least portions of side boundaries of the antenna pattern above the ground pattern, and extends above the antenna pattern.

An antenna apparatus includes: a feed line; a first ground layer including surface disposed above or below the feed line and spaced apart from the feed line; and an antenna pattern electrically connected to an end of the feed line and configured to transmit and/or receive a radio frequency (RF) signal, wherein the first ground layer includes a first protruding region protruding in a first longitudinal direction of the surface toward the antenna pattern and at least partially overlapping the feed line above or below the feed line, and second and third protruding regions protruding in the first longitudinal direction from positions spaced apart from the first protruding region in opposite lateral directions of the surface.

A chip antenna module array includes a connection member and chip antenna modules mounted on the connection member. Each chip antenna module includes: a first patch antenna dielectric layer; a feed via extending through the first patch antenna dielectric layer; and a patch antenna pattern disposed on an upper surface of the first patch antenna dielectric layer and configured to be fed from the feed via. At least one chip antenna module includes: a ground pattern disposed on a lower surface of the first patch antenna dielectric layer; a chip-antenna feed line including a second part disposed on a lower surface of the ground pattern, and electrically connecting a connection member feed line to the feed via; a first feed line dielectric layer disposed on a lower surface of the second part; and a solder layer disposed on a lower surface of the first feed line dielectric layer.

Chip antenna module array and chip antenna module

An antenna module includes a connection member, an integrated circuit (IC) on a first surface thereof, and an antenna package on a second surface thereof. The connection member includes a wiring layer and an insulating layer. The IC is electrically connected to the wiring layer. The antenna package includes first antenna members and feed vias each electrically connected to a corresponding one of the first antenna members and a corresponding wire of the wiring layer. A feed line is electrically connected to a wire of the wiring layer and extends in a side direction of the second surface, a second antenna member is electrically connected to the feed line and is configured to transmit and/or receive an RF signal in the side direction, and a director member is spaced apart from the second antenna member in the side direction and has an inside boundary oblique to the second antenna member.

Growing community of inventors

Suwon-si, South Korea

Jeong Ki Ryoo