Samsung Electro-mechanics Co., Ltd.

Seoul National University

Kyungpook National University Industry-academic Cooperation Foundation

Jeong Joo Kim

Chang Hee Lee

Sang Wook Lee

Jin Ho Kim

Yul Kyo Chung

Eun Tae Park

Hyeok Kim

Hyo Soon Shin

Min Ji Ko

Hee Young Lee

Sang Hyub Kim

Eun Sub Lim

Young Woo Heo

Joon Hyung Lee

Jong Chul Lee

Jeong Woo Han

A quantum dot light emitting diode according to various embodiments of the present disclosure includes a first electrode and a second electrode that are opposite to each other; a light emitting layer that is located between the first electrode and the second electrode and includes a quantum dot; and an electron transport layer that is arranged between the first electrode and the light emitting layer and includes a metal oxide thin film, wherein the metal oxide thin film has a composition including at least one selected from the group consisting of InO, ZnO, SiOand SnO.

Light-emitting diode and method for producing same

The invention relates to a high-dielectric constant metal/ceramic/polymer composite material and a method for producing an embedded capacitor. As ceramic particles having a relatively small size are bound to the surface of metal particles having a relatively large size by mixing, the occurrence of percolation can be prevented without coating the metal particles, and at the same time, the capacitance of an embedded capacitor can be increased. In addition, a process for coating the surface of the metal particles can be omitted, thus contributing to the simplification of the overall preparation procedure.

High-dielectric constant metal-ceramic-polymer composite material and method for producing embedded capacitor using the same

Disclosed is a composition for forming a dielectric, which is applied to an embedded capacitor with a high dielectric constant, a capacitor produced using the composition, and a PCB provided with the capacitor. The composition includes 40 to 99 vol % of thermoplastic or thermosetting resin, and 1 to 60 vol % of semiconductive filler. Alternatively, the composition includes 40 to 95 vol % of thermoplastic or thermosetting resin, and 5 to 60 vol % of semiconductive ferroelectric substance. Furthermore, the present invention provides the capacitor, produced using the composition, and the PCB provided with the capacitor. Therefore, the dielectric, which is produced using the composition including the semiconductive filler or semiconductive ferroelectric substance, is advantageous in that the dielectric constant is high and a dielectric loss is low. The dielectric is usefully applied to produce an embedded capacitor with the high dielectric constant and the PCB provided with the embedded capacitor.

Composition for forming dielectric, capacitor produced using composition, and printed circuit board provided with capacitor

Growing community of inventors

Daegu, South Korea

Jeong Joo Kim