Samsung Electronics Co., Ltd.

Jeong-Jin Lee

Chan Soo Hwang

Sun-Pil Youn

Hoondo Heo

Hyun-Suk Choi

Hyesoon Jeong

Seok-Yong Lee

Youngho Cho

Moo-Young Kim

Iljoo Chae

Kyoung-Bok Cho

Dae-Sik Hwang

Songgeun Kim

Yo-Se Eum

Tea-Seog Um

Jong-Woo Ko

Kyucheol Kong

Chang-Hee Hong

Seung-Hwa Oh

Various embodiments of the present invention provide a method and apparatus for preventing a user's unintentional touch input in an electronic device. According to various embodiments of the present invention, an electronic device may comprise: a display for displaying a user interface; a memory; and a processor functionally connected to the display and the memory, wherein the processor is configured to set a touch blocking area in the edge area of the display, determine an exception area in the touch blocking area on the basis of the user interface, remove the determined exception area from the touch blocking area, so as to set a final touch blocking area, and process a touch event on the edge area on the basis of the final touch blocking area. Various embodiments are possible.

Electronic device and operation method therefor

An apparatus and method for processing a user input in an electronic device are provided. The electronic device includes a touch device detecting a touch input; a pressure device detecting a pressure input; and at least one processor. The at least one processor is configured to if the pressure input is detected, generate an event corresponding to the pressure input, determine if the touch input is detected while the pressure input is detected, if the touch input is detected while the pressure input is detected, update the event to correspond to the pressure input and the touch input, and process the updated event.

Method for processing user input and electronic device thereof

An solder ball mounter includes a stage configured to support a substrate, a ball placer head configured to provide solder balls, and a solder ball mask configured to align the solder balls with the substrate. The solder ball mask includes an upper mask layer including an upper opening having a first diameter, a middle mask layer including a middle opening having a second diameter that is larger than the first diameter, and a lower mask layer.

Solder ball mounter

A method of detecting an asymmetric portion of an overlay mark includes forming a plurality of virtual overlay marks having a plurality of virtual asymmetric portions. The virtual asymmetric portions may have different sizes with respect to a reference model profile of a reference overlay mark. Virtual information with respect to each virtual overlay mark may be obtained. The virtual information of the virtual overlay marks may be compared with actual information of an actual overlay mark to identify virtual information of the virtual overlay mark corresponding to the actual information of the actual overlay mark. Thus, measuring the overlay of the actual overlay mark may be performed under than the actual asymmetric portion may be excluded from the actual overlay mark, so that the overlay may be accurately measured. As a result, errors may not be generated in a correcting process to a layer using the accurate overlay.

Method of detecting an asymmetric portion of an overlay mark and method of measuring an overlay including the same

Provided is a semiconductor package including a high integration semiconductor chip and having a minimum area to be mounted on a circuit board. The semiconductor package includes a semiconductor chip, a plurality of inner leads, and an encapsulant. The plurality of inner leads include upper and bottom surfaces and are electrically connected to the semiconductor chip. The encapsulant covers the semiconductor chip and the plurality of inner leads. The upper surfaces of the plurality of inner leads are fixed to the encapsulant, portions of the bottom surfaces of the plurality of inner leads are exposed from the encapsulant, and the bottom surfaces of the plurality of inner leads are disposed at a different height from a bottom surface of the encapsulant.

Semiconductor package with inner leads exposed from an encapsulant

Growing community of inventors

Seoul, South Korea

Jeong-Jin Lee