Nvidia Corporation

Jeong Hun Kim

Zoran Stefanoski

Tommy Lee

Zhihai Zack Yu

Don Le

Samuel Abbay

A heat transfer system, method, and computer program product are provided for use with multiple circuit board environments. In use, a heat transfer component configured to be situated between a first circuit board and a second circuit board is provided. Such heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board. Furthermore, the heat transfer component is situated between the first circuit board and the second circuit board.

Heat transfer system, method, and computer program product for use with multiple circuit board environments

A heat exchanger carrier system, method, and computer program product are provided. Included is a circuit board with components mounted thereon. Further included is a carrier coupled to the circuit board. Also included is a plurality of heat exchangers coupled to the carrier for transferring heat from the components.

Circuit board heat exchanger carrier system and method

A system and method are provided for controlling a transfer of heat between circuit board components. Included is a circuit board with components mounted thereon. Also provided is a controllable heat transfer medium for controlling a transfer of heat between the components.

Controllable heat transfer medium system and method for use with a circuit board

One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. The hybrid heat transport module and the fansink may be used alone or in combination to dissipate heat from the processor.

System for efficiently cooling a processor

One embodiment of a system for efficiently cooling a processor includes a mounting plate configured to be thermally coupled to the processor, a passive heat transport device thermally coupled to the mounting plate and a heat exchanger coupled to the passive heat transport device.

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Sunnyvale, CA, United States of America

Jeong Hun Kim