Samsung Electronics Co., Ltd.

Jeong Ho Bang

Byung Man Kim

Shin Hyoung Kim

Ho Tae Jin

Hyeong Sik Choi

Woo Jin Kim

In Pyo Hong

Chan Hong Park

Jong Myung Lee

Hyo Jae Jang

Il Heung Choi

Joo Suk Kwak

Kyung Wan Kim

Sun Weon Jeong

Disclosed herein is a display apparatus that reduces a magnitude of a tension applied to a flexible PCB when a display panel is provided with a curved surface, and prevents damage of a driving chip. The display apparatus in accordance with exemplary embodiments includes a display panel configured to display an image, a source printed circuit board configured to control the display panel, and a flexible PCB that connects the display panel and the source printed circuit board. A length of at least one side edge of the flexible PCB is formed longer than a minimum length from the display panel to the source printed circuit board.

Display apparatus

The present invention relates to a broadband switching drive compensating circuit for a video display device, which comprises a horizontal size detecting unit for detecting a horizontal size; a horizontal frequency detecting unit for detecting a horizontal frequency; a first DC voltage generating unit for generating a first DC voltage according to the detected horizontal size; a second DC voltage generating unit for generating a second DC voltage according to the detected horizontal frequency; a driving current compensating unit for altering a B driving current according to the generated first and second DC voltages; and a horizontal deflection unit for switching a horizontal output transistor according to the altered B driving current and then supplying a sawtooth current to a horizontal deflection coil. In a multi-mode video display device having a broadband frequency, the driving conditions of a switching power transistor is compensated according to the changes of the horizontal size and the horizontal frequency for establishing the driving conditions of the switching power transistor to the optimum conditions, to thereby perform the stable switching operations of the switching power transistor.

Broadband switching drive compensating circuit for a video display device

A method for manufacturing lead-on-chip (LOC) semiconductor packages includes steps of preparing a lead frame having inner leads and outer leads, and applying a liquid adhesive having a certain viscosity to the bottom surfaces of the inner leads. The method also includes positioning a semiconductor chip under the lead frame, to expose electrode pads through the space defined between opposing rows of inner leads. The inner leads are then attached to the active surface of the semiconductor chip by means of the liquid adhesive. The adhesive applying step may be carried out using a tool having discharge projections through which liquid adhesive is discharged from a reservoir. The liquid adhesive under the lead frame may be cured and then turned into a solid adhesive layer by thermocompression. The liquid adhesive is a thermosetting resin or a thermoplastic resin.

Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads

A method for separating semiconductor devices formed on a semiconductor wafer includes: inscribing the semiconductor wafer along scribe lines; mounting the inscribed semiconductor wafer on a stage including an elastic structure and vacuum suction holes that can be aligned to respective semiconductor chips; applying a vacuum through the vacuum suction holes to hold the semiconductor wafer on the elastic structure; and applying a mechanical force to the semiconductor wafer to break the wafer along the scribe lines and separate the semiconductor devices. A device for separating semiconductor devices formed on a wafer includes a stage including an elastic structure and vacuum suction holes that can be aligned with respective semiconductor chips of the semiconductor wafer and a press for applying mechanical force to the semiconductor wafer on the elastic structure. Since use of a wafer tape is avoided in cutting a semiconductor wafer, package cracking and delamination caused by wafer tape adhesive stuck to the back surface of a semiconductor chip are avoided.

Chip separation device and method

A voltage control circuit to control a focus exactly by controlling a front/back porch voltage level of a vertical focus control signal regardless of a slight error in an upper and a lower part of a cathode-ray tube. In order to control the front/back porch level of the vertical focus control signal, a certain level of a DC voltage put out by a level controller is added to a saw tooth wave generated by integrating a DC voltage put out by a microcomputer in a first integrator. In a second integrator, a parabola wave is generated by secondly integrating the DC voltage. The level of the DC voltage added to the saw tooth wave is controlled by putting out the generated parabola wave as the vertical focus control signal according to a slight error generated in the upper and the lower part of a cathode-ray tube, and this enables to control the front/back porch voltage level of the vertical focus control signal and the focus exactly in the upper and the lower part of the screen.

Front/back porch voltage-regulator of vertical focus control signal

A method for detecting operational errors in a tester of a test system for determining whether a semiconductor device is good or failed includes a diagnostic test having the step of periodically inputting data to the device and checking whether the data can be retrieved intact from the tester. If not, then an operational error may be present in the tester. The method requires that the diagnostic test be carried out after a predetermined number of devices has been tested, and that the data inputted to the device during the diagnostic test be inputted to every I/O pin of the device. The diagnostic test includes inputting a value of 0 to each I/O pin, and then comparing the output of the device to a predetermined expected value. The diagnostic test also includes inputting a value of 1 to each I/O pin, and similarly comparing the output to an expected value.

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Suwon, South Korea

Jeong Ho Bang