Samsung Electronics Co., Ltd.

Jeong-ho Ahn

Jae-Kwan Park

Deok-Yong Kim

Hyung-Suk Cho

Soo-Bok Chin

Hyo-Cheon Kang

Woong-Kyu Son

Il-Suk Park

A method of automatic defect classification (ADC) includes detecting defective parts from a substrate wherein at least one unit process is performed; and classifying defect types of the respective defective parts, wherein the classifying includes obtaining a scanning electron microscope (SEM) image of each of the defective parts; registering information about the substrate in a graphic data system (GDS) image corresponding to each SEM image; defining a plurality of defects of interest (DOIs) categorizing defects of the respective defective parts; defining a DOI rule that is a criterion for determining which defects of the respective defective parts correspond to which DOI from among the DOIs; and analyzing the image to classify which defects of the respective defective parts correspond to which DOI from among the DOIs according to the DOI rule.

Method of automatic defect classification

Methods of analyzing photolithography processes are provided. The methods may include obtaining an image from a pattern formed on a wafer and obtaining dimensions of the image. The methods may further include converting the dimensions into a profile graph and then dividing the profile graph into a low-frequency band profile graph and a high-frequency band profile graph.

Method of analyzing photolithography processes

Growing community of inventors

Hwaseong-si, South Korea

Jeong-ho Ahn