Lg Innotek Co., Ltd.

Korea Institute of Industrial Technology

Hyundai Electronics Industries Co. Ltd.

Other

Lg Electronics Inc.

Sin Yeong Co., Ltd.

Hyundai Media Systems Co., Ltd.

Young Bok Han & Korean Assoc. of Creation Research

Jeong Han Kim

In Hee Cho

Won Keun Cho

Hyun Gyu Park

Bi Yi Kim

Hyun Jin Jo

Chang Woo Lee

Jun Ki Kim

Yong Suk Kim

Seung Kwon Hong

Young Ki Ko

Moo Seong Kim

Jeung Ook Park

Hyun Gu Im

Sang In Yoon

Yong Hwa Park

Sehoon Yoo

Se Hoon Yoo

Jin Young Kim

Soo Min Lee

Sung Jin Lee

Sung Woo Choi

Hyeong In Choi

Jong Bae Kim

Eun Kyung Hong

Nam Su Lee

Nam Sook Wee

Sang A Ju

Kyung Hwan Park

Young Bok Han

Seung Won Song

Kyung Rae Kim

Hwan Pyo Moon

Ji Na Lee

Cheol Hee Kim

Hyun Gil Shin

Kyung Tae Kim

Hong Ki Kyung

Yong Ho Ko

Jung Hwan Bang

Min Young Eom

Yeong Kyu Lim

Jong Dock Seo

Myung Joo Baek

Shin Hae Tahk

Hal Lan Yang

Hyun Joo Choi

Dea Keun Kim

Kwang Woo Won

Hae Ri Kim

Jeong Jo Mun

Choon Won Kim

Yue Seon Shin

A resin composition for a semiconductor package according to an embodiment includes a resin composition that is a composite of a resin and a filler disposed in the resin, wherein the filler has a content in a range of 68 wt % to 76 wt % in the resin composition, wherein the filler includes a first filler group composed of fillers having a first diameter; a second filler group composed of fillers having a second diameter smaller than the first diameter; and a third filler group composed of fillers having a third diameter smaller than the second diameter, and contents of each of the first filler group, the second filler group, and the third filler group in the filler are different from each other.

Resin composition for semiconductor package, resin coated copper, and circuit board comprising same

A resin coated copper according to an embodiment includes: an insulating layer including a resin and a filler dispersed in the resin; and a copper foil layer disposed on the insulating layer, wherein the insulating layer has a plurality of pores formed on a surface in contact with the copper foil layer, and the plurality of pores have a width of 200 nm to 350 nm.

Resin coated copper and circuit board including the same

A circuit board according to an embodiment comprises: an insulation layer; a circuit pattern disposed on the upper surface or under the lower surface of the insulation layer; and a buffer layer disposed on at least one surface of the upper surface and the lower surface of the insulation layer, wherein the buffer layer includes carbon, nitrogen, and oxygen, the ratio of the nitrogen to the carbon ((carbon/nitrogen)*100) is 5 to 15, and the ratio of the oxygen to the carbon ((carbon/oxygen)*100) is 15 to 30.

Circuit board including a buffer layer for improving

A circuit board according to an embodiment includes: an insulating portion including a plurality of insulating layers; a circuit pattern disposed on surfaces of the plurality of insulating layers; and a via passing through at least one insulating layer among the plurality of insulating layers; wherein the insulating portion includes: a first insulating portion including at least one insulating layer; a second insulating portion disposed on the first insulating portion and including a plurality of insulating layers; and a third insulating portion disposed under the first insulating portion and including a plurality of insulating layers; wherein the first insulating portion is formed of prepreg containing glass fibers, wherein at least one of the second insulating portion and the third insulating portion includes a resin coated copper (RCC) and a solder resist disposed on the RCC, wherein the circuit pattern is disposed on a surface of the solder resist, and wherein the via is formed passing through the solder resist.

Circuit board

A pressure sensing insole according to an embodiment of the present invention includes: a first electrode layer including a first conductive region; a first adhesive layer disposed on the first electrode layer and including an insulating region; an intermediate layer disposed on the first adhesive layer; a second adhesive layer disposed on the intermediate layer and including an insulating region; and a second electrode layer disposed on the second adhesive layer and including a second conductive region.

Pressure sensing insole

A pressure sensing element may include: an intermediate layer having a structure in which at least two functional layers are stacked on each other; a first electrode layer including a plurality of first electrode patterns; and a second electrode layer to overlap the first electrode layer with the intermediate layer between the first and second electrode layers. Among the two functional layers, the first functional layer has a thickness linearly varying in a first pressure section, and the second functional layer has a thickness linearly varying in a second pressure section. The maximum pressure in the first pressure section is lower than that in the second pressure section, and the minimum pressure in the second pressure section is included in the first pressure section.

Pressure sensing element (and safety apparatus) having intermediate layer with two functional layers

Disclosed in an embodiment is a pressure detection sensor comprising: an elastic layer including a hole; and an electrode layer including a plurality of electrodes arranged on the elastic layer so as to be spaced apart, wherein the elastic layer includes a variable member arranged in the hole, the plurality of electrodes are electrically connected to each other by outside pressure, and at least one of the plurality of electrodes covers a part of the hole.

Pressure detection sensor and pressure detection insole including same

A direction detecting device according to an exemplary embodiment of the present invention includes; a structure having at least two through-holes passing through an upper surface and a lower surface thereof; and at least two electrode units inserted into the at least two through-holes and each including a dielectric layer, a first electrode layer disposed on an upper surface of the dielectric layer and exposed at the upper surface of the structure, and a second electrode layer disposed on a lower surface of the dielectric layer and exposed at the lower surface of the structure.

Capacitance sensor and direction detection device including same

A pressure sensor formed in a sheet type is provided, including conductive fibers, nonconductive fibers, and piezoresistive fibers, which are woven together, wherein the pressure sensor includes a first electrode layer including the conductive fibers and the nonconductive fibers, a second electrode layer including the conductive fibers and the nonconductive fibers, and a piezoresistive layer including the piezoresistive fibers and disposed between the first electrode layer and the second electrode layer.

Pressure sensor

A pressure-sensing chair according to one embodiment of the present invention comprises: a first electrode having a first conductive region formed in a first direction; a second electrode having a second conductive region formed in a second direction; a sensing sheet including an intermediate layer arranged between the first electrode and the second electrode; a first elastic body arranged on the sensing sheet and having a first elastic modulus; and a plurality of second elastic bodies arranged in the first elastic body and having a second elastic modulus, which is greater than the first elastic modulus.

Pressure-sensing chair, including first elastic body having lower elastic modulus than second elastic bodies arranged therein

The present invention relates to a pressure sensing chair capable of wireless charging, detecting body pressure, and measuring the distribution of body pressure. A pressure sensing chair according to one embodiment of the present invention comprises: at least one sensor unit including a first electrode layer having a plurality of first electrode patterns arranged in a first direction, a second electrode layer having a plurality of second electrode patterns arranged in a second direction crossing the first direction, and a dielectric layer arranged between the first electrode layer and the second electrode layer; and a module unit connected to the sensor unit and including a communication unit and a wireless charging unit.

Pressure sensing chair

A direction detection device, according to one embodiment of the present invention, comprises: a dielectric layer; a first electrode layer which is arranged on a first surface of the dielectric layer, and which comprises a plurality of first electrode patterns arranged in a first direction; a second direction arranged on a second surface of the dielectric layer, which faces the first surface; a capacitance detection unit which detects changes in capacitance due to time difference between a first region and a second region, wherein in the first region, at least one selected among the plurality of first electrode patterns overlaps the second electrode layer, and in the second region, at least one selected from the plurality of the remaining first electrode patterns overlaps the second electrode layer; and a direction detection unit which connects to the capacitance detection unit, and detects a movement direction on the basis of the time difference between the first region and the second region.

Direction detection device

A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

Method for filling a wafer via with solder

A printed circuit board having an improved heat radiation performance, and a light-emitting device including the same are provided. The printed circuit board includes a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, and a second electrode layer disposed on the first insulation layer. The first insulation layer includes a cavity formed through a part thereof. At least a portion of the one surface of the first electrode layer may be exposed to the outside through the cavity.

Printed circuit board and light-emitting device including same

Apparatus for filling a wafer via with solder

Growing community of inventors

Seoul, South Korea

Jeong Han Kim