Samsung Electronics Co., Ltd.

Jeong Don Ihm

Jang Woo Lee

Byung Hoon Jeong

Dae Hoon Na

Young Don Choi

Jin Do Byun

Byung Kwan Chun

Seung Woo Yu

Seon Kyoo Lee

Sang Lok Kim

Provided are multi-chip packages. A multi-chip package includes a first memory chip and a second memory chip on a printed circuit board; a memory controller electrically connected to the first memory chip and the second memory chip via a first bonding wire and a second bonding wire; and a strength control module configured to control a drive strength of each of a first output driver of the first memory chip and a second output driver of the second memory chip, wherein the memory controller includes an interface circuit configured to receive each of first test data and second test data from the first output driver and the second output driver in which the drive strength is set by the strength control module, and output detection data for detecting whether the first bonding wire and the bonding wire are short-circuited based on the first and second test data.

Multi-chip package

A nonvolatile memory device includes a first memory cell array, a first bi-directional multiplexer, a first register, a second register, a first I/O pad and a second I/O pad. The first memory cell array stores first data. The first bi-directional multiplexer receives the first data and distributes the first data into first sub-data and second sub-data. The first register stores first sub-data from the first bi-directional multiplexer. The second register stores second sub-data from a second bi-directional multiplexer. The first I/O pad outputs the first sub-data from the first register to outside. The second I/O pad outputs the second sub-data from the second register to the outside.

Nonvolatile memory device

A semiconductor package including a first master-slave status circuit configured to store one of a first signal or a second signal independently from a second master-slave status circuit, store the first signal in response to receiving a first initial signal from a first initialization circuit, the second master-slave status circuit configured to store one of the first signal or the second signal, store the first signal in response to receiving a second initial signal from a second initialization circuit, the first initialization circuit configured to provide the first initial signal to the first master-slave status circuit, the second initialization circuit configured to provide the second initial signal to the second master-slave status circuit, and a first master-slave determination circuit connected to the second master-slave status circuit, the first master-slave determination circuit configured to provide the second signal to the second master-slave status circuit may be provided.

Semiconductor package

A memory device that includes an interface that receives a data signal and a strobe signal from an external device, the strobe signal corresponding to the data signal; a strobe buffer that receives the strobe signal from the interface; a phase detection unit that detects a phase difference between the data signal output from the interface and the strobe signal output from the strobe buffer; a phase adjust unit that adjusts a phase of the strobe signal output from the strobe buffer based on the phase difference; and a sampling unit that samples the data signal output from the interface based on the strobe signal output from the phase adjust unit.

Growing community of inventors

Seongnam-si, South Korea

Jeong Don Ihm