Samsung Display Co., Ltd.

Jeong Do Yang

Jung Yun Jo

Jeong Ho Hwang

Byoung Yong Kim

Seung-Hwa Ha

Seung-soo Ryu

Tae Ho Lee

Su Bin Bae

Seung Hwa Ha

Chung-Seok Lee

Sang Hyeon Song

Jang-Kyum Kim

Chung Seok Lee

A display device includes a display panel including a first region and a second region adjacent to the first region and being extendable, a supporting plate configured to support the first region of the display panel and being inflexible, and an extending portion supporter configured to support the second region of the display panel and being deformable, wherein the extending portion supporter includes a first metal thin film layer and a second metal thin film layer overlapping each other.

Display device

A display device includes: a first roller; a second roller; a gear unit that is coupled to the second roller and configured to rotate with the second roller; a rail unit that is engaged with the gear unit; a housing where the rail unit is provided; and a display panel module of which one end is fixed to the housing and the other end is fixed to the second roller and is configured to be bent by the first roller and then rolled on the second roller, wherein the display panel module is configured to be slide-extended and slide-retracted as the gear unit and the rail unit operate while being engaged with each other.

Display device and moving method thereof

A semiconductor chip includes: a base substrate; a conductive pad on one surface of the base substrate; an insulating layer on the one surface of the base substrate and having an opening exposing a portion of the conductive pad; and a bump on the exposed portion of the conductive pad and on the insulating layer around the opening. The bump includes a plurality of concave portions corresponding to the opening and is arranged in a longitudinal direction of the bump.

Semiconductor chip, electronic device including the same, and method of connecting the semiconductor chip to the electronic device

A display device includes a display substrate and a printed circuit board (PCB). The display substrate includes a display area to display an image, and includes a pad area outside the display area. The PCB is bonded to a surface of the display substrate in the pad area. The PCB includes a base film, first terminal wires positioned at the base film, second terminal wires positioned at the base film, first sub-pad terminals electrically connected to the first terminal wires through contact holes formed in the base film, and second sub-pad terminals directly and electrically connected to the second terminal wires without contact holes. The first sub-pad terminals and the second sub-pad terminals are alternately arranged. The first terminal wires and the second terminal wires are, in a view normal to the surface, spaced apart from one another.

A circuit board, a display device including the same, and a method of manufacturing a circuit board are provided. A circuit board includes a base substrate, a wiring line provided on the base substrate, a passivation layer provided on the wiring line, an elastic bump provided on the passivation layer, and a conductive layer provided on the elastic bump. The passivation layer includes a first opening and a second opening that expose a partial region of the wiring line, and the second opening is arranged in a region adjacent to the first opening.

Circuit board, display device including the same, and method of manufacturing the circuit board

A display device includes: a flexible substrate having a display area for displaying an image and a peripheral area outside the display area; a first pad electrode in the peripheral area of the flexible substrate; and a driver connected to the first pad electrode. The driver includes: a circuit board including a driving circuit; a second pad electrode on one side of the circuit board and facing the first pad electrode; a convex structure on one side of the second pad electrode and having an oval cross-section; and a bump electrode on one side of the convex structure and connected to the first pad electrode. The bump electrode includes a column covering the convex structure and a convex portion extending from one side of the column and protruding to the first pad electrode.

Display device and manufacturing method thereof

An integrated circuit includes a substrate, a pad electrode disposed on the substrate, and a passivation layer disposed on the pad electrode and including an organic insulating material. The integrated circuit further includes a bump electrode disposed on the passivation layer and connected to the pad electrode through a contact hole. The passivation layer includes an insulating portion having a first thickness and covering an adjacent edge region of the pad electrode and the substrate, and a bump portion having a second thickness, that is greater than the first thickness, and covering a center portion of the pad electrode.

Integrated circuit for a stable electrical connection and manufacturing method thereof

A display device is disclosed. In one aspect, the display device includes a substrate including a display area and a non-display area and an input wiring portion and an output wiring portion formed in the non-display area. The display device also includes a driver integrated circuit (IC) formed over the substrate and electrically connected to the input and output wiring portions. Each of the input and output wiring portions includes a metal layer and a metal carbide layer that covers the metal layer.

Display device including metal layer and metal carbide layer covering the metal layer

A display device includes a panel substrate including a pad region, and a COF (Chip On Film) including a wire region, the wire region including a plurality of wires connected to the pad region of the panel substrate, wherein the plurality of wires in the wire region is arranged into a plurality of sections, intervals between wires within each section being different from intervals between wires within an adjacent section, and at least one of the plurality of sections including a plurality of wires at a fixed interval.

Growing community of inventors

Yongin-si, South Korea

Jeong Do Yang